Optical module and optical transmitter

Abstract

An optical module and an optical transmitter are disclosed. The optical module includes a waveguide substrate including an optical waveguide and electrodes that apply electronic signals to the optical waveguide; a relay substrate disposed adjacent to the waveguide substrate; a terminal substrate disposed adjacent to the waveguide substrate and opposite to the relay substrate across the waveguide substrate; and a carrier substrate on which the waveguide substrate, the relay substrate, and the terminal substrate are mounted. The electrodes have a first interconnect unit from the relay substrate to the terminal substrate via the waveguide substrate and second interconnect units from the first interconnect unit and branching on the terminal substrate. Among the second interconnect units, a first interconnect branch includes a capacitor and a terminal resistor; and a second interconnect branch is connected to an interconnect of the carrier substrate via a bias resistor, passes under the waveguide substrate to a DC electrode for bias-adjusting on the relay substrate.

Description

technical field [0001] Embodiments discussed herein relate to optical modules and optical transmitters used in optical transmission. Background technique [0002] For example using electro-optic crystal substrates such as LiNbO 3 (LN) substrate and LiTaO 2 substrates) or semiconductor substrates (such as GaAs substrates and InP substrates) are considered to be optical modules. This optical waveguide device is formed by forming a metal film made of titanium (Ti) on a part of a substrate and thermally diffusing the film, or by performing proton exchange in benzoic acid after a patterning process. Electrodes are then formed near the optical waveguide to construct an optical module, such as an optical modulator. [0003] When driving such an optical modulator at high speed, it is assumed that the terminal of the signal electrode is connected to the terminal of the ground electrode via a resistor to form a traveling wave electrode, and a high-speed microwave signal (electrical...

AI Technical Summary

Problems solved by technology

This causes the problem that the size of the relay substrate (e.g. along the length of the parallel waveguides of the Mach-Zehnder modulator unit) increases and the size of the module housing the Mach-Zehnder modulator unit also increases

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