Location ejecting device for stamping die
A technology of ejection device and stamping die, which is applied in the field of stamping dies, can solve the problems of complex structure of the ejection switching mechanism, long debugging time, and large space occupation, so as to save installation and debugging time, reduce space occupation, and facilitate installation and operation. The effect of maintenance
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[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0030] Such as figure 2 and image 3 As shown, the positioning and ejecting device of the present invention includes: a jacking mechanism; a supporting plate 1 whose bottom surface is arranged on the jacking mechanism, and the jacking mechanism can jack up or drop the supporting plate 1; the positioning and ejecting block 2, which are respectively arranged at both ends of the top surface of the supporting plate 1; the lower mold base 3, which is arranged at the lower end of the jacking mechanism, can be disassembled and connected with ...
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