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Blade, manufacturing method thereof, and blade assembly

A blade and component technology, applied in the field of semiconductor device manufacturing, can solve problems such as increased vibration, decreased cutting performance, and low effective blade stiffness

Inactive Publication Date: 2015-05-06
HITACHI GLOBAL STORAGE TECH NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cutting with high aspect ratio blades results in reduced cutting performance due to lower effective blade stiffness and increased vibration

Method used

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  • Blade, manufacturing method thereof, and blade assembly
  • Blade, manufacturing method thereof, and blade assembly
  • Blade, manufacturing method thereof, and blade assembly

Examples

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Embodiment Construction

[0015] Hereinafter, examples of the present invention are mentioned. It should be understood, however, that the invention is not limited to specific described embodiments. Rather, any combination of the following features and elements (whether related to different embodiments or not) is contemplated to implement and practice the invention. Furthermore, although embodiments of the invention may achieve advantages over other possible solutions and / or over the prior art, whether a given embodiment achieves a particular advantage is not a limitation of the invention. Accordingly, the following aspects, features, embodiments and advantages are merely illustrative and are not to be considered elements or limitations of the appended claims except as expressly recited in the claims. Likewise, reference to "the present invention" should not be construed as a generalization of any inventive subject matter disclosed herein, and should not be considered an element or limitation of the ap...

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PUM

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Abstract

Embodiments of the present invention generally relate to a blade for isolating devices within a wafer and the method of isolating. The blade has a core material, a cutting material disposed on the core material, and a plating material covering a portion of the core and cutting materials. The edge of the blade is not covered by the plating material. During operation, a portion of the plating material is removed to expose the underlying core and cutting materials based on the wearing of the core and cutting materials at the edge of the blade.

Description

technical field [0001] Embodiments of the present invention relate generally to semiconductor device fabrication, and more particularly to blades for dicing substrates. Background technique [0002] Die separation by sawing, or dicing, is the process of using a rotating abrasive saw blade to cut a thin film microelectronic substrate into individual devices such as sliders containing read / write recording devices. Scribing by means of sawing offers versatility in choice of cut depth and width (kerf), as well as choice of surface finish, and can be used to partially or completely saw through a substrate or wafer. Wafer dicing technology has developed rapidly, and dicing is now commonly used in most front-end thin film packaging operations. Scribing is widely used for the separation of dies on thin film integrated circuit wafers. [0003] The device density of wafers is constantly increasing to reduce unit cost. As a result of increasing device density within a wafer, channel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/22H01L21/02
CPCB24D5/12B24D3/34B24D18/00
Inventor J·博凯奇C·邦霍特T·奥尔森
Owner HITACHI GLOBAL STORAGE TECH NETHERLANDS BV