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Plating device

A plating device and plating technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as imbalance in the composition of the plating solution, and achieve the effect of suppressing the imbalance in composition and suppressing loss

Active Publication Date: 2017-04-12
YAZAKI CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this electroless plating, by-products may accumulate as the reducing agent for plating is oxidized, and thus the composition balance of the plating solution may be out of balance (for example, refer to Non-Patent Document 1).

Method used

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  • Plating device
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Examples

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Embodiment Construction

[0041] figure 1 It is an explanatory drawing which schematically shows the plating apparatus 1 which concerns on this embodiment. The plating apparatus 1 is an apparatus for performing a plating process on an object to be plated by electroless plating. Plating objects are, for example, tensile fibers, including para-aramid fibers, PBO (poly(p-phenylenebenzobisoxazole), poly(p-bisoxazole)) fibers, polyarylate fibers, and ultra-high molecular weight polyethylene fiber etc.

[0042] The coating device 1 is configured to include: a first coating tank 2, a first supply tank 3, a second coating tank 4, a second supply tank 5, a guide mechanism 6, a reserve tank 7, a cleaning solution tank 8, and a water washing tank 9. , and the control unit 10.

[0043] The first plating tank 2 is a tank for storing a plating solution, and by immersing the tensile fiber F in the stored plating solution, the tensile fiber F can be plated. The first plating tank 2 has a predetermined length along...

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Abstract

A plating device provided by the present invention restrains the abnormal deposition of the metal and corresponds to the strip of a plated object. The plating device possesses the first plating grooves (2), a first supply tank (3) circulating the plating liquid between the first plating grooves (2); the second plating grooves (4); a second supply tank (5) for circulating the plating liquid between the second plating grooves (4); a presetting tank (7) capable of recycling the plating liquid; a guide mechanism (6) configured to move between the first and second plating grooves (2, 4) and dip the plated object in one of the first and second plating grooves (2, 4); and a control part (10) for switching the state of storing the plating liquid in one plating groove and enabling the other plating groove to be empty between the first and second plating grooves (2, 4), and switching the guide mechanism (6) correspondingly according to the switching of the plating grooves (2, 4) in which the plating liquid is stored.

Description

technical field [0001] The present invention relates to a plating device. Background technique [0002] In recent years, for the purpose of high strength, light weight, bending resistance, etc., plated fibers are proposed in which tensile fibers are plated to ensure electrical conductivity (see, for example, Patent Document 1). [0003] As a technique for forming a metal film on the surface of a fiber material, for example, electroless plating is known. In this electroless plating, by-products may accumulate due to the oxidation of the reducing agent for plating, and thus the composition balance of the plating solution may be out of balance (for example, see Non-Patent Document 1). [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Japanese Patent Laid-Open Publication No. 2013-108198 [0007] non-patent literature [0008] Non-Patent Document 1: Tomoyuki Fujinami, "Current Status and Future of Electroless Copper Plating", Surface Techno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/31
Inventor 近藤宏树吉永聪菅沼延之
Owner YAZAKI CORP