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Novel diode lead gluing equipment

A sealing device and diode technology, applied to the surface coating liquid device, coating, etc., can solve the problems of lead wire production efficiency, large lead wire carrier volume, etc., to improve the overall production efficiency, facilitate logistics and processing Effect

Active Publication Date: 2015-10-07
定远县润声电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing sealing process, the lead wires are usually placed on a certain carrier for transmission. When the lead wires are sealed, that is, the lead carrier is transported, the current process often requires manual stacking and sorting of the carriers. Due to the large size of the lead carrier, the overall production efficiency of the lead will be affected

Method used

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  • Novel diode lead gluing equipment
  • Novel diode lead gluing equipment
  • Novel diode lead gluing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 , figure 2 and image 3 A diode lead wire sealing device that can achieve uniform gluing is shown, which includes a support platform 1, a transmission chain 2 for transporting diodes is arranged on the support platform 1, and a sealing device for sealing the diode leads. The rubber rack 3 contains a plurality of upwardly extending sealing teeth 31, and the sealing rack 3 extends parallel to the transmission chain 2; the sealing rack 3 is provided with a glue port 4, which is connected to the glue groove 5 provided on the support platform 1 . The diode lead wire sealing device that can realize uniform gluing is provided with a lead wire placement end block 6, which is fixed on the transmission chain 2, and a plurality of lead wire placement end blocks 6 that are parallel to each other are provided with a plurality of lead wire placement holes 7. The axis of the lead wire placement hole 7 is extended perpendicular to the transmission chain 2; the corr...

Embodiment 2

[0035] As an improvement of the present invention, in the support bracket 11, the end positions of the two first support rods 111 away from the transmission chain are provided with an auxiliary support plate 17 extending vertically upward, and the auxiliary support plate 17 The height is 2 cm. With the above design, on the one hand, it can prevent the end block of the lead wire from moving to the outside of the support bracket due to its inertia, causing the end block of the lead wire to fall or even be damaged; When the supporting bracket connects with the lead wire placement end block and descends to the corresponding height of the collecting tank, the auxiliary support plate prevents the lead wire placement end block from sliding down during the flipping process of the support bracket connecting with the lead wire placement end block, causing its placement Misalignment occurs; the height limitation of the auxiliary support plate prevents it from affecting the lead placement...

Embodiment 3

[0038] As an improvement of the present invention, in the collecting tank 8, an adsorption pipeline 18 is arranged on the side surface away from the end of the transmission chain 2, which is connected to a vacuum adsorption pump 19 arranged outside the collecting tank 8; The adsorption pipe 18 extends above the inner wall of the collecting tank 8 . With the above-mentioned design, it can make the lead wire placement end block stably fixed on the side end surface of the collecting tank through the adsorption effect generated by the vacuum adsorption pump and the adsorption pipeline, so that multiple lead wire placing end blocks can be carried out in the collecting tank. It can maintain good stability when placed.

[0039] The remaining features and advantages of this embodiment are the same as those of Embodiment 2.

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PUM

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Abstract

The invention discloses novel diode lead gluing equipment which comprises a support platform. A conveying chain and a gluing rack are disposed on the support platform. The gluing rack comprises a plurality of gluing teeth. The gluing rack is provided with a feed opening communicated with a glue tank. The novel diode lead gluing equipment further comprises lead holding end blocks placed on the conveying chain, each lead holding end block is provided with a plurality of lead holes parallel to one another, the end of the conveying chain is correspondingly provided with a collection trough which is connected with a screw extending parallelly to the conveying chain; and the screw is connected with a step motor used for driving the screw. According to the technical scheme, the novel diode lead gluing equipment has the advantages that by the collection trough and corresponding drive devices, the lead holding end blocks can be automatically collected during gluing.

Description

technical field [0001] The invention relates to a processing equipment for electronic components, in particular to a novel diode lead wire sealing device. Background technique [0002] The leads of the diode need to be sealed with glue so that they can be prepared into a complete diode. In the existing sealing process, the lead wires are often repeatedly contacted between multiple sealing teeth on the sealing rack, so that the glue liquid above the sealing teeth realizes gluing treatment on the leads. In the existing sealing process, the lead wires are usually placed on a certain carrier for transmission. When the lead wires are sealed, that is, the lead carrier is transported, the current process often requires manual stacking and sorting of the carriers. Because the volume of the lead carrier is often large, the overall production efficiency of the lead will be affected. Contents of the invention [0003] The technical problem to be solved by the present invention is t...

Claims

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Application Information

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IPC IPC(8): B05C1/06B05C13/02B05C11/10
Inventor 蒋元昌蒋有新
Owner 定远县润声电子有限公司
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