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Substrate based surface mount device (smd) light emitting assembly and method

A technology of light-emitting components and substrates, which is applied in semiconductor devices, electric solid-state devices, electrical components, etc., and can solve the problems of expensive reflector cavity, SMD installation, time-consuming, etc.

Active Publication Date: 2017-08-25
CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Separately molded component bodies and formed mirror cavities can be expensive and time consuming
To date, there is currently no SMD installed around a separate substrate or panel, instead the current product is usually molded separately

Method used

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  • Substrate based surface mount device (smd) light emitting assembly and method
  • Substrate based surface mount device (smd) light emitting assembly and method
  • Substrate based surface mount device (smd) light emitting assembly and method

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Embodiment Construction

[0021] The subject matter disclosed herein relates to substrate-based surface mount design (SMD) light emitting assemblies and methods, eg, substrate-based light emitting diode (LED) assemblies and methods. The assemblies and methods provided herein can exhibit improved manufacturability and provide custom assemblies for supporting LED chips and allowing their electrical connectivity without the expense associated with custom ceramic or plastic packaging.

[0022] Notably, individual substrates and / or substrate-based components can be partitioned from a larger panel of materials (eg, ceramic substrates) and can allow a multitude of different components to be formed thereon. In some aspects, the light emitting assemblies and methods described herein do not require a reflector cavity disposed around the LED chip to reflect light. In some aspects, light emitting assemblies described herein can include non-metallic substrate material(s) that are substantially reflective and do not...

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PUM

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Abstract

Substrate based surface mount design (SMD) light emitting assemblies and related methods are disclosed. In some aspects, the light emitting assembly can include: a substrate including a first side having a first surface area; first and second electrical contacts disposed on the first side of the substrate; and at least one light emitting chip, on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of ​​the first side of the substrate. Assemblies disclosed herein may include low-profile members or domes, wherein the ratio between dome height and dome width is less than 0.5. A method of providing an assembly may include: providing a panel of material and LED chips; dispensing a liquid encapsulant material over the panel; and separating the panel into individual panel-based assemblies after the encapsulant material hardens.

Description

[0001] Cross References to Related Applications [0002] This application is related to, and claims priority to, U.S. Patent Application No. 13 / 755,993, filed January 31, 2013, which is an application of U.S. Patent Application Nos. 13 / 800,260 and 13 / 800,284, both filed March 13, 2013 Continuation-in-Part wherein, each of the foregoing applications claims priority to U.S. Provisional Patent Application Nos. 61 / 618,327, filed March 30, 2012, and 61 / 642,995, filed May 4, 2012, the entirety of which applications are incorporated In this article, for reference. technical field [0003] The subject matter disclosed herein relates generally to surface mount device (SMD) assemblies and methods. More particularly, the subject matter disclosed herein relates to substrate-based SMD light emitting assemblies and methods. Background technique [0004] Light-emitting diodes (LEDs), or LED chips, are solid-state devices that convert electrical energy into light. LED chips can be used w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/62
CPCH01L33/54H01L33/62H01L33/486H01L2933/0033H01L2224/48091H01L2224/48137H01L2924/181H01L2924/00014H01L2924/00012
Inventor 克勒斯托弗·P·胡赛尔埃琳·R·F·韦尔希杰西·科林·赖尔策彼得·斯科特·安德鲁斯
Owner CREELED INC (N D GES D STAATES DELAWARE NEWARK)