mpw chip backside metallization method

A backside metallization and chip technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as damage, damage, and incomplete chips, and achieve the effect of strong operability and low risk reduction
CN105097501BActive Publication Date: 2017-10-31WUXI ZHONGWEI GAOKE ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
WUXI ZHONGWEI GAOKE ELECTRONICS
Publication Date
2017-10-31

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Abstract

The invention relates to a back metallization method for a multi-project wafer (MPW) chip. The method comprises the following steps: (1) carrying out required cutting and selecting on a first accompanied chip to form a chip setting support block; (2) putting a chip to be subjected to back metallization into a chip setting lattice of the chip setting support block in a right-side up manner; (3) carrying out required cutting and selecting on a second accompanied chip to form a support block setting lattice for embedding the chip setting support block in the second accompanied chip; (4) putting the chip setting support block embedded with the chip to be subjected to back metallization into the support block setting lattice of the second accompanied chip to form a third accompanied chip body; and (5) carrying out required back metallization operation on all chips to be subjected to back metallization in the third accompanied chip body. According to the back metallization method suitable for the chips with various dimensions and specifications, the front surfaces of the chips can be well protected; and non-damage fixation of the chips is realized, so that the target of back metallization on the chips is reached.
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Description

technical field

[0001] The invention relates to a process method, in particular to a MPW (Multi Project Wafer) chip backside metallization method, which belongs to the technical field of integrated circuit manufacturing. Background technique

[0002] In the existing backside metallization process, the main body of the backside metallization is a complete wafer, and the backside metallization of the chip cannot be performed using the conventional wafer backside metallization process technology. This is because the edge of a complete wafer is an incomplete chip, and the existing backside metallization equipment can clamp the edge, and it is acceptable that the edge is not plated with metal or has damage.

[0003] However, for chip-level backside metallization, there is no space for clamping at the edge of the chip, and the tolerable damage is extremely slight, and micron-level damage may completely lead to chip scrapping. At the same time, during the entire production process...

Claims

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