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Communication circuit with impedance matching

An impedance matching circuit, impedance matching technology, applied in impedance matching network, circuit, impedance network and other directions, can solve problems such as problems, loss, etc.

Inactive Publication Date: 2015-11-25
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In some instances, this loss may be on the order of -7dB or higher, or may be associated with the loss of half the energy of the transmitted signal
Also, problems can arise when the reflected signal is not recoverable
[0004] These and other things create challenges for communicating between devices for a variety of applications and using a variety of standards and speeds

Method used

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  • Communication circuit with impedance matching
  • Communication circuit with impedance matching
  • Communication circuit with impedance matching

Examples

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Embodiment Construction

[0023] While the various embodiments discussed herein are intended to include various modifications and alternative forms, aspects of the embodiments are illustrated and described in detail in the drawings. It should be understood, however, that the intention is not to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure including aspects defined by the claims. Furthermore, the term "example" as used throughout this application is illustrative only and not intended to be limiting.

[0024] It is believed that aspects of the present disclosure can be applied to many different types of devices, systems, and methods involving impedance matching. Although not limited thereto, aspects of the invention can be appreciated through a discussion of examples in this context.

[0025] Various example embodiments relate to improving signal...

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PUM

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Abstract

Aspects of the present disclosure are directed to addressing impedance-matching issues. As may be implemented in connection with one or more embodiments, an apparatus includes an integrated circuit (IC) chip having a signal-connection terminal and processing circuitry that passes signals along a communication path that is within the IC chip and connected to the signal-connection terminal. Impedance-matching circuitry operates to provide impedance-matching for the communication path, therein mitigating signal loss due to impedance-mismatching. A chip-mounting structure secures the IC chip and electrically connects thereto at the signal-connection terminal.

Description

technical field [0001] Aspects of various embodiments relate to communication, such as between electronic devices, and related impedance matching. Background technique [0002] Many electronic devices communicate with each other through one or more communication channels. Ensuring the integrity of these communications is critical and difficult to achieve. For example, the mobile phone, PC, smart TV, and tablet industries generally require small integrated circuits (ICs) with wafer-level chip-scale packaging, which makes it possible to reduce the size of the IC after mounting the IC on the printed circuit boards of both the host and device systems. The overall height of the chip. Additionally, these systems operate to allow hosts and devices to communicate using multiple interface standards that operate using different speeds (eg, 10Gbps, 5.4Gbps, 5Gbps, and 8Gbps). Furthermore, signal integrity requirements become more important at higher data rates (eg, 10 Gbps). [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/40
CPCH03H7/40H01L23/66H01L24/13H01L24/16H01L2223/6655H01L2224/131H01L2224/16225H01L2924/10253H01L2924/14H01L2924/30111H03H11/30H01L2924/014
Inventor 马旦·维穆拉詹姆斯·斯佩哈
Owner NXP BV