Leadless local gold electroplating method
A local electroplating, leadless technology, used in electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as high cost and residual leads, and achieve the effect of reducing production costs and avoiding noise.
Inactive Publication Date: 2015-12-09
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology
[0012] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a local electroplating method without leads, which aims to solve the problems of residual leads and high cost in the existing electroplating method
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[0024] The present invention provides a leadless local gold electroplating method. In order to make the objectives, technical solutions and effects of the present invention clearer and clearer, the present invention will be described in further detail below. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0025] See figure 1 , figure 1 It is a flowchart of a preferred embodiment of a leadless partial gold electroplating method according to the present invention. As shown in the figure, it includes the steps:
[0026] S1. Perform the first circuit pattern production on the PCB, so that the PAD and the board edge that need to be electroplated gold are exposed, and the other positions are covered with dry film, and then electroplating gold;
[0027] S2, the gold-plated backing film, cover the gold-plated PAD with dry film, and make the second circuit pattern in other position...
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The invention discloses a leadless local gold electroplating method, which comprises the following steps: (A) carrying out first circuit pattern fabrication on a printed circuit board (PCB) to expose a PAD which requires gold electroplating and plate edges, covering the other positions with a dry film, and then carrying out gold electroplating; and (B) removing the film after gold electroplating, covering the gold-electroplated PAD with the dry film, and carrying out second circuit pattern fabrication on the other positions. According to the leadless local gold electroplating method, a lead does not need to be designed to be connected to each gold-electroplated PAD, so that a lead residue is avoided; irrelevant signals caused by excessive leads in the operation process after the PCB is assembled into an electronic product are avoided; and aiming at a leadless gold-electroplated board, gold electroplating on the entire board is not needed, so that the production cost is greatly reduced.
Description
Technical field [0001] The invention relates to the field of PCB electroplating, in particular to a leadless partial gold electroplating method. Background technique [0002] Electroplating gold is a method of PCB surface treatment. It is mostly used for buttons, sliders and gold finger boards. At present, there are two common electroplating methods in the industry: the partial electroplating method with leads and the whole plate electroplating method without leads. [0003] Among them, the partial gold electroplating method with leads includes: [0004] ⑴. In the graphic production process, pull a lead wire for the required gold-plated PAD to the edge of the PCB, so that the gold-plated PAD and the copper on the edge of the board are connected; [0005] ⑵ After the completion of the graphics, the post-process solder mask production is performed, and the gold plating process is performed after the solder mask [0006] ⑶. Paste the PAD other than the gold finger with blue glue before el...
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Login to View More IPC IPC(8): H05K3/18
CPCH05K3/188H05K2203/0723
Inventor 谢伦魁王俊刘赟张传超
Owner SHENZHEN KINWONG ELECTRONICS