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Optoelectronic devices

A technology of optoelectronic devices and electrodes, which is applied in the direction of electric solid-state devices, photovoltaic power generation, electrical components, etc., and can solve problems such as damage to thin film packages, damage to the operation of optoelectronic devices, and delamination of the covering substrate layer

Active Publication Date: 2017-08-08
OSRAM OLED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of mechanical loading of the optoelectronic component, delamination of the covering substrate layer can occur, which can damage the thin-film encapsulation and impair the operation of the optoelectronic component

Method used

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  • Optoelectronic devices
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Embodiment Construction

[0050] In the exemplary embodiments and figures, identical or identically acting components are provided with the same reference signs. The elements shown and their relative size relations to one another are in principle not to be regarded as true to scale, but for better illustration and / or better comprehension the individual elements can be shown with exaggerated thickness or size. Elements such as layers, components, devices, and regions.

[0051] figure 1 An optoelectronic device according to a first embodiment of the invention is shown. A transparent first electrode layer 2 is arranged on a substrate layer 1 made of glass. Arranged on the first electrode layer 2 is a radiation-emitting layer sequence 4 , which comprises one or more functional layers of organic material and in which an active region 20 is formed, the active region 20 being formed therefrom. The source region emits electromagnetic radiation during operation. Arranged on the layer sequence 4 is a second ...

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Abstract

An optoelectronic component, comprising in particular: a substrate (1); a first electrode (2) on the substrate (1); a radiation-emitting or radiation-absorbing layer sequence (4) on the first electrode (2) ); a second electrode (6) on the layer sequence (4); an encapsulation layer (8) arranged on the second electrode (6) and a cover layer (24) arranged on the encapsulation layer (8), said The cover layer has a first main surface (14) and a second main surface (16), wherein at least one predetermined fracture is provided between the first main surface (14) and the second main surface (16) of the cover layer (24) face (18).

Description

technical field [0001] An optoelectronic component is presented below which has a radiation-emitting or radiation-absorbing layer sequence. [0002] This patent application claims priority from German patent application 102013105128.6, the disclosure of which is incorporated herein by reference. Background technique [0003] Optoelectronic components such as organic light-emitting diodes (OLEDs) or organic solar cells often have thin-film encapsulations which are to protect the electrodes and the radiation-emitting or radiation-absorbing layer sequences of the optoelectronic component against moisture and / or against oxidation. Substances such as oxygen. For mechanical protection of the thin-film encapsulation, an additional cover substrate layer, which can consist of glass, for example, is usually applied to the thin-film encapsulation. When the optoelectronic component is mechanically stressed, delamination of the covering substrate layer can occur, which can damage the t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52
CPCY02E10/549H10K50/841H10K50/844H10K30/88
Inventor 西蒙·希克坦茨
Owner OSRAM OLED