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Electronic component conveying device and electronic component inspection device

A technology of electronic components and handling devices, applied in the direction of electronic circuit testing, measuring devices, measuring electricity, etc.

Inactive Publication Date: 2019-01-01
NS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the shutter described in Patent Document 1 is composed of a plate-shaped member that opens and closes the entire entrance of the cavity, and is not a shutter that can be opened and closed for the IC housing portion of each IC tray.

Method used

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  • Electronic component conveying device and electronic component inspection device
  • Electronic component conveying device and electronic component inspection device
  • Electronic component conveying device and electronic component inspection device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach ＞

[0085] figure 1 It is a schematic plan view which shows 1st Embodiment of the electronic component inspection apparatus of this invention. Figure 2 ~ Figure 4 Respectively means figure 1 A cross-sectional view of the temperature adjustment unit of the electronic component inspection apparatus shown. Figure 5 yes means figure 1 It is a top view of the change cover board of the temperature adjustment part of the electronic component inspection apparatus shown. Figure 6 yes means figure 1 It is a top view of the case of the temperature adjustment part of the electronic component inspection apparatus shown. Figure 7 yes means figure 1 It is a top view of the gate of the temperature adjustment part of the electronic component inspection apparatus shown. Figure 8 as well as Figure 9 are used to illustrate figure 1 It is a top view of the operation of the temperature adjustment unit of the electronic component inspection apparatus shown. Figure 10 is configured in fi...

no. 2 approach ＞

[0178] Figure 12 It is a plan view showing the casing of the temperature adjustment unit of the second embodiment of the electronic component inspection apparatus of the present invention. Figure 13 It is a plan view showing the shutter of the temperature adjustment unit of the second embodiment of the electronic component inspection apparatus of the present invention.

[0179] Hereinafter, although the second embodiment will be described, the description will focus on the differences from the above-mentioned first embodiment, and the description of the same items will be omitted.

[0180] The inspection device 1 of the second embodiment is the same as the first embodiment above except that the shapes of the second opening 442 of the housing 44 of the temperature adjustment unit 12 and the first opening 452 of the shutter 45 are different from those of the first embodiment. .

[0181] Such as Figure 12 As shown, the second openings 442 of the casing 44 are arranged in th...

no. 3 approach ＞

[0189] Hereinafter, although the third embodiment will be described, the description will focus on the differences from the above-mentioned first embodiment, and the description of the same matters will be omitted.

[0190] In the inspection device 1 of the third embodiment, the shutter 45 of the temperature adjustment unit 12 is replaceable, and can be replaced with other same-type or different-type components as necessary.

[0191] Specifically, the gate 45 can be replaced with a gate different in at least one of the shape, size (dimension) and position of the first opening 452 , especially can be replaced with at least one of the size and position of the first opening 452 . A different gate on one side. In addition, the size of the first opening 452 of the gate 45 is set based on the size of the IC device 90 . In addition, the gate 45 is replaced with a gate that can correspond thereto based on, for example, the shape and size (dimensions) of the IC device 90 to be inspect...

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Abstract

An electronic component transfer device comprises: a first place; a second place different from the first place; an arranging element which is located in the second place, and on which a plurality of electronic components are arranged; and a shutter which is operable toward at least one lengthwise direction of the arranged direction of the electronic components, and which touches the first and second places. A plurality of first openings are formed on the shutter. In addition, different humidity of the first place and the second place is desirable. Also, it is desirable that humidity of the second place is lower than humidity of the first place.

Description

technical field [0001] The present invention relates to an electronic component conveyance device and an electronic component inspection device. Background technique [0002] Conventionally, for example, an electronic component inspection device for inspecting electrical characteristics of electronic components such as IC devices is known, and the electronic component inspection device is provided with an electronic component transfer device for transferring the IC device to a holding unit of the inspection unit. When inspecting an IC device, the IC device is arranged on a holding portion, and a plurality of probe pins provided on the holding portion are brought into contact with each terminal of the IC device. [0003] Such IC device inspection may be performed by cooling the IC device to a predetermined temperature. In this case, the IC device is cooled, and the humidity of the surrounding atmosphere of the components where the IC device is arranged is lowered so as not t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2601G01R31/2853G01R31/2893
Inventor 桐原大辅前田政己下岛聪兴
Owner NS TECH INC