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Inductor component

A component, inductor technology

Pending Publication Date: 2021-03-26
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, it has been found that, in the above-mentioned conventional inductor components, if the thickness of the insulating resin layer is reduced in order to improve the characteristics, the thickness of the insulating resin layer covering the top surface and side surfaces of the coil wiring cannot be formed at 10 μm or less. kind of problem
This is because the conventional insulating resin layer is laminated with resin such as epoxy resin on the first coil wiring by punching, and the resin is fully filled between the lines of the first coil wiring, and at the same time completely covers the top surface of the first coil wiring, forming the first coil wiring. Because of the interlayer thickness between the coil wiring and the second coil wiring, it is very difficult to reduce the thickness of the insulating resin layer at the time of press lamination to 10 μm or less
In addition, the side surface of the insulating resin layer after press lamination can be processed by photolithography or laser, but the processing accuracy becomes a speed limit, and it is very difficult to make the thickness of the side surface of the insulating resin layer as thin as 10 μm or less.
Therefore, the inventors of the present application found that, after attempting to reduce the thickness of the insulating resin layer by an insulating electrodeposition process, an insulating film with a thickness of 10 μm or less of the insulating resin layer covering the top and side surfaces of the coil wiring was successfully formed. In some cases, the coil wiring may be exposed from the insulating coating

Method used

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  • Inductor component
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Experimental program
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Effect test

no. 1 Embodiment approach

[0040] (structure)

[0041] Figure 1A It is a perspective plan view showing the first embodiment of the inductor component. Figure 1B yes Figure 1A A-A cutaway view.

[0042] The inductance component 1 is mounted in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, and automotive electronics, for example, and is, for example, a rectangular parallelepiped-shaped component as a whole. However, the shape of the inductance component 1 is not particularly limited, and may be a columnar shape, a polygonal columnar shape, a truncated cone shape, or a polygonal truncated cone shape.

[0043] Such as Figure 1A and Figure 1B As shown, the inductance component 1 includes: a main body 10, a first coil wiring 21 and a second coil wiring 22 arranged in the main body 10, an insulating film 15 covering the first coil wiring 21 and the second coil wiring 22 respectively, and an end face from the main body. The first main surface 10a of 10 ...

no. 2 Embodiment approach

[0087] figure 2 It is a sectional view showing the second embodiment of the inductor component. The shape of the corner portion of the coil wiring is different between the second embodiment and the first embodiment. This different configuration will be described below. The other configurations are the same as those of the first embodiment, and are given the same reference numerals as those of the first embodiment, and description thereof will be omitted.

[0088] Such as figure 2 As shown, in the inductor component according to the second embodiment, the shape of the corner portion 214A of the first coil wiring 21A is a C plane (45° chamfered plane). Specifically, the wedge-shaped corner portion 214A is located between the top surface 211 and the side surface 213 of the first coil wiring 21A. Accordingly, it is easy to realize a structure in which the thickness T4 of the corner is 1 / 2 or more of the thickness of at least one of the thickness T1 of the top surface and the...

no. 3 Embodiment approach

[0094] Figure 4 It is a sectional view showing the third embodiment of the inductor component. The shape of the corner portion of the coil wiring is different between the third embodiment and the first embodiment. This different configuration will be described below. The other configurations are the same as those of the first embodiment, and are given the same reference numerals as those of the first embodiment, and description thereof will be omitted.

[0095] Such as Figure 4 As shown, in the inductor component of the third embodiment, the shape of the corner portion 214B of the first coil wiring 21B is a convex curved surface. Specifically, the R-shaped corner portion 214B is located between the top surface 211 and the side surface 213 of the first coil wiring 21B. Accordingly, it is easy to realize a structure in which the thickness T4 of the corner is 1 / 2 or more of the thickness of at least one of the thickness T1 of the top surface and the thickness T3 of the side...

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Abstract

The present invention provides an inductor component capable of suppressing exposure of coil wiring from an insulating coating film. An inductance member includes: a body having a magnetic layer containing magnetic powder and a resin containing the magnetic powder; a coil wiring arranged in the main body; and an insulating coating film that covers the coil wiring and does not contain a magnetic body, and in a cross section of the coil wiring orthogonal to the extending direction, a top surface thickness (T1) of a portion of the insulating coating film that covers a top surface of the coil wiring and a side surface thickness (T3) of the insulating coating film that covers a side surface of the coil wiring are 10 [mu] m or less. The corner thickness (T4) of a portion of the insulating film covering a corner between the top surface and the side surface of the coil wiring is 1 / 2 or more of the thickness of at least one of the top surface thickness (T1) and the side surface thickness (T3).

Description

technical field [0001] The present invention relates to inductive components. Background technique [0002] Conventionally, as an inductance component, there is a component described in JP 2014-32978 A (Patent Document 1). The inductance component includes: a supporting layer, a first coil wiring provided on the supporting layer, a magnetic layer covering a part of the first coil wiring, a supporting layer, an insulating resin layer covering the first coil wiring and the magnetic layer, and an insulating resin layer provided on the insulating resin layer. on the 2nd coil wiring. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2014-32978 [0004] However, it has been found that, in the above-mentioned conventional inductor components, if the thickness of the insulating resin layer is reduced in order to improve the characteristics, the thickness of the insulating resin layer covering the top surface and side surfaces of the coil wiring cannot be formed at 10 μm or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/04H01F27/255H01F27/32
CPCH01F17/04H01F27/255H01F27/324H01F2017/048H01F17/0006H01F2017/0066H01F27/292H01F27/2804H01F27/32H01F41/0246H01F41/041H01F41/12
Inventor 富永隆一朗山口公一滨田显德三宅敢平井真哉
Owner MURATA MFG CO LTD