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Support arrangement for a substrate and device and method for using the support arrangement for a substrate

A technology for supporting devices and substrates, used in lighting and heating equipment, transportation and packaging, furnaces, etc., to solve problems such as expensive manufacturing and maintenance

Active Publication Date: 2018-12-11
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Other known supports that operate from the rear side of the carrier are very expensive to manufacture and maintain

Method used

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  • Support arrangement for a substrate and device and method for using the support arrangement for a substrate
  • Support arrangement for a substrate and device and method for using the support arrangement for a substrate
  • Support arrangement for a substrate and device and method for using the support arrangement for a substrate

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Embodiment Construction

[0021] Reference will now be made in detail to various embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals designate the same elements. In general, only differences with respect to individual embodiments are described. Each example is provided by way of explanation of the invention, and each example is not intended as a limitation of the invention. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other implementations to yield a further embodiment. The description is intended to cover such modifications and variations.

[0022] According to typical embodiments, which may be combined with other embodiments described herein, the substrate thickness may be from 0.1 to 1.8 mm, and the support arrangement, in particular the support means, may be adapted for such substrate thicknesses. However...

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Abstract

A support arrangement (10) for supporting a substrate (20) during vacuum layer deposition is provided. The support arrangement (10) includes: a frame (30) configured to support a substrate (20); and one or more support devices (40) attached to the frame (30) and configured to provide a support force to the substrate (20) . Each support device (40) includes: an elastic unit (41) configured to provide a support force; and a snap member (42) configured to be snapped to provide a release force (52) opposite to the support force, thereby releasing the substrate (20).

Description

technical field [0001] Embodiments of the invention relate to a support arrangement for supporting a substrate during processing (eg layer deposition). Embodiments of the invention relate in particular to a support arrangement for supporting a substrate during vacuum layer deposition. Background technique [0002] Several methods are known for depositing materials on substrates. For example, the substrate may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, or the like. Typically, the process is performed in a process tool or process chamber in which the substrate to be coated is located. A deposition material is provided in an apparatus. A variety of materials and oxides, nitrides or carbides of these materials can be used for deposition on the substrate. Additionally, other steps like etching, structuring, annealing, etc. can be performed in the process chambe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/50C03C17/00B65G49/06C23C16/458
CPCC03C17/002C23C14/50C23C16/4585
Inventor O·海梅尔A·布吕宁
Owner APPLIED MATERIALS INC