Cutting method for bonded substrates

Abstract

The invention relates to a method for cutting of a bonded substrate. When scribing is performed on the bonded substrate, a useless nominal part of a substrate, which is provided with a sealing part can be removed to be maximally narrowed, and a cutting surface can be cut smoothly. In a method for cutting of a bonded substrate (10), which cuts on a sealing part (8) formed between an upper part glass part (11a) and a lower part glass part (11b) of the bonded substrate (10), the following stages are included: laser is irradiated to a position where at least one of the upper part glass part (11a) and the lower part glass part (11b) contacts with the sealing part (20), and cutting lines (13a, 13b) are formed on an inner surface side of at least one of the upper part glass part (11a) and the lower part glass part (11b); and a scribing wheel (70) is utilized to scribe at least one of the upper part glass part (11a) and the lower part glass part (11b) along the cutting lines (13a, 13b); and thus the method has an effect of being capable of forming a beautiful cutting surface.

Description

technical field [0001] The present invention relates to a method for cutting a bonded substrate. More specifically, the present invention relates to a method for scribing and cutting a liquid crystal substrate by using a laser, which can not only minimize the useless part of the substrate, that is, the dummy where the sealing layer is formed. part, and can obtain a smooth cutting surface of the bonding substrate cutting method. Background technique [0002] In general, conventionally, when dicing liquid crystal substrates, when dicing unnecessary portions of the substrate, that is, dummy portions in which the sealing layer is formed, dicing is performed only with a scribing wheel. [0003] Specifically, in a general liquid crystal substrate, after the liquid crystal layer is filled between the upper glass part and the lower glass part, the frame part of the liquid crystal layer is covered with a sealing layer (sealing layer) so that the liquid crystal layer does not leak to ...

AI Technical Summary

Problems solved by technology

[0009] However, the sealing layer has a brittle property like rubber, so when using a scribing wheel to scribe the sealing layer of the liquid crystal substrate, the following problems will occur. If the scribing line touches the brittle sealing layer, the straightness will be lost. , or cannot move along the scribing line but move in other directions, and the substrate is defective when the substrate is cut

[0010] In particular, in the conventional upper and lower scribing wheel methods for scribing bonded substrates, the actual situation also has the following problem: it is difficult to cut deep into the seal between the upper glass part and the lower glass part constituting the bonded substrate. Layer, even after the scribing operation of the scribing wheel is completed, a part of the sealing layer remains and the sealing layer is not completely cut, and the glass part is not completely separated

[0011] In addition, the actual situation is that the linearity of the scribing wheel decreases due to the sealing layer, the dummy portion cannot be removed from the liquid crystal substrate to a desired degree, and the cut surface of the liquid crystal substrate does not have a smooth surface due to the sealing layer. Increases defective products that must be discarded

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