A floating fuse type surface mount fuse and its preparation method

Abstract

Embodiments of the invention provide a suspended fuse type surface mounting fuse and a preparation method thereof. The suspended fuse type surface mounting fuse comprises at least one cavity plate provided with a first cavity, an upper substrate and a lower substrate which are respectively overlapped above and below the cavity plate, side terminal electrodes and multiple layers of parallel fuses, wherein the upper substrate at least comprises a top plate, and the lower substrate at least comprises a bottom plate; the upper substrate and / or the lower substrate and the cavity plate form blind holes at two ends; the side terminal electrodes are arranged on both ends of the outer lateral surfaces / surface of the upper substrate and / or the lower substrate and the surfaces of the blind holes; and the middle parts of the fuses are suspended in the first cavity and both ends of the fuses are located at the bottoms of the blind holes. The fuse with the suspended fuses and multiple layers of parallel fuses has a most important characteristic that current shunt can be realized, so that the fuse has high breaking capacity and ability to resist high pulse and surge.

Description

technical field [0001] The invention belongs to a floating fuse type surface mounted fuse, in particular to a suspended fuse type surface mounted fuse realized by blind hole electroplating and a preparation method thereof. Background technique [0002] With the development of science and technology, power / electronic products are increasingly diversified and complex, and the circuit protection components used are no longer simple glass tube fuses in the past, but have developed into a wide variety of new electronic components. Surface mount As a new light and small component, the fuse is suitable for the protection circuits of various electronic products with compact structure and small size, and its application field is very wide. [0003] Hollow fuse type fuses and solid device type fuses are the two main types of small surface mount fuses. The hollow fuse type small fuse is to suspend the fuse (wire) in the hollow shell. Both ends of the fuse are fixed in different ways ...

AI Technical Summary

Problems solved by technology

[0012] The expansion coefficient of the base material of the inner wall of the through hole is larger and higher than that of the coating metal, so that at a higher temperature, the coating will peel off from the base material, resulting in the elongation of the fuse, and if the fuse is small, it will be broken

[0013] 2. The circuit board with a cavity needs to be bonded with glue, and part of the glue flows out along the wire to the hole and covers the wire end, resulting in poor connectivity between the fuse and the fuse, thus affecting product performance

[0014] 3. The fuse is exposed in the through hole and is not fixed, so it is easy to be broken, resulting in poor connectivity between the fuse and the fuse, thus affecting product performance

[0015] In addition, the traditional hollow fuse type surface mount fuse generally arranges the fuse in the middle of the cavity. This structure requires that the hole walls around the cavity have a certain strength to resist fusing, and fusing is a shock; With the miniaturization of electronic products, fuses are required to be lighter and thinner. This requires the thickness of the hole wall to be compressed. When the hole wall thickness is thin to a certain extent, it may be fused, and the fusing is to generate energy to break through. This restricts the hollow fuse type. Miniaturization of surface mount fuses

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