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A heat pump system

A heat pump system and heat exchanger technology, applied in the field of heat pumps, can solve the problems of low utilization rate of high-temperature heat sources, achieve the effects of increasing utilization rate, reducing working temperature difference, and improving heating performance coefficient

Active Publication Date: 2019-04-16
GREE ELECTRIC APPLIANCES INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention provides a heat pump system to solve the problem of low utilization of high-temperature heat sources in the prior art

Method used

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Embodiment Construction

[0027] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the invention, some specific details are set forth in detail. The present invention can be fully understood by those skilled in the art without the description of these detailed parts. To avoid obscuring the essence of the present invention, well-known methods, procedures, procedures, and components have not been described in detail.

[0028] Refer below figure 2 and image 3 Embodiments of the heat pump system of the present invention will be described.

[0029] like figure 2 As shown, the present invention provides a heat pump system, which includes two sets of refrigerant circulation loops, that is, the first refrigerant circulation loop and the second refrigerant circulation loop, and also includes an intermediate heat exchange device 5, through which the first The refrigerant circulation loop and the...

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Abstract

The invention aims to provide a heat pump system. The problem of a low utilization rate of a high-temperature heat source of an existing heat pump system is mainly solved. The heat pump system provided by the invention is provided with two refrigerant circulation loops. Refrigerant flowing out of a condenser in one refrigerant circulation loop and refrigerant, which is about to flow into an inlet of an evaporator, of the other refrigerant circulation loop are subjected to heat exchange in a middle heat exchange device. The evaporating temperatures of the two refrigerant circulation loops are different and the condensing temperatures of the two refrigerant circulation loops are also different by arranging the middle heat exchange device. The heat pump system can utilize a high-temperature part of the high-temperature heat source and also utilize a medium-low temperature part of the high-temperature heat source by means of the different evaporating temperatures, so that the utilization rate of the high-temperature heat source is greatly increased. Besides, a gradient heating effect on a heated medium can be achieved by means of the different condensing temperatures, so that the working temperature difference of the condensers is reduced and the heating performance coefficient of the heat pump system is improved.

Description

technical field [0001] The invention relates to the field of heat pumps, in particular to a heat pump system. Background technique [0002] Conventional high-temperature heat pumps generally use such as figure 1 The shown single-stage compression heat pump circulation system includes a compressor, a condenser, a throttling device and an evaporator connected in sequence. In order to obtain a higher heating temperature, the refrigerant with a higher critical temperature generally works at a higher condensation temperature, and the working temperature difference between the heated medium and the heated medium is larger. When the temperature of the heat source is lower, the heat pump heating performance coefficient COP Low; when the temperature of the heat source is high, such as industrial waste heat, only the high temperature part of the heat source can be used and the middle and low temperature parts are wasted. Contents of the invention [0003] In view of this, the pres...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B7/00
CPCF25B7/00
Inventor 梁祥飞方金升郑波黄明月
Owner GREE ELECTRIC APPLIANCES INC
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