Integrated cleaning fixture capable of automatically fixing silicon wafer during rotation

Abstract

The invention discloses an integrated cleaning fixture capable of automatically fixing a silicon wafer during rotation, belonging to the technical field of fabrication of a semiconductor. The integrated cleaning fixture comprises a silicon wafer fixing disc, wherein a plurality of arc clamping rings with different diameters and a centrifugal press device for fixing the silicon wafer are arranged on the silicon wafer fixing disc, the silicon wafer fixing disc comprises a support disc at the center, a plurality of ribs and a reinforcement outer ring, the plurality of ribs are uniformly arranged at the periphery of the support disc and outwards extend, the reinforcement outer ring is arranged at the end parts of the ribs and can be used for connecting and fixing all the ribs, the ribs are of stepped structures gradually increased from center to outside, and the arc clamping rings are vertical arc connection surfaces connecting with adjacent step planes. By means of the fixed disc and the press device, the silicon wafer can be automatically fixed, the front surface and the back surface are cleaned, the risks that the fixture is eccentric and the silicon wafer is dumped can be effectively prevented, the silicon wafer is convenient to load and unload and is not needed to be fixed manually, and the labor cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to an integrated cleaning jig for automatically rotating and fixing a silicon wafer. Background technique [0002] The cleaning of semiconductor devices mainly adopts ultrasonic cleaning and water vapor two-fluid cleaning. Among them, ultrasonic cleaning has undetermined damage to semiconductor devices, so it is a prohibited or restricted process in some fields; water vapor two-fluid rotary cleaning can be effective. It removes organic contamination and movable particles on the surface of the wafer, so it has been widely used in the fields of semiconductor manufacturing and packaging. However, when cleaning some light, thin, and fragile semiconductor devices with water vapor two-fluid, there are also the following risks: [0003] For example, silicon wafers are characterized by lightness, thinness, and fragility. They are easy to fall and break due t...

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Problems solved by technology

[0006] In view of this, the purpose of the present invention is to provide an integrated cleaning jig that automatically rotates and fixes the silicon wafer, which can automatically fix the silicon wafer during rotation, and can perform double-sided cleaning at the same time, which solves the problems in the prior art. The back side cannot be cleaned, the rotation is easy to eccentric, and the replacement efficiency is low

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