Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resistive Sensor Array Fast Readout Circuit, Readout Method, and Sensing System

A resistive sensor and readout circuit technology, applied in the field of sensors, can solve the problems of destroying the ideal isolation feedback condition of the readout circuit, the influence of the test accuracy of the resistive sensor array, and the large measurement error of the resistance value of the measured unit, etc., to achieve scanning The effect of high measurement speed, short cycle time and reduced influence

Active Publication Date: 2017-10-31
SOUTHEAST UNIV
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lead resistances with basically the same resistance and contact resistances with different resistances have a significant impact on the test accuracy of the resistive sensor array
As far as the shared row and column resistive sensor array based on the equipotential method is concerned, the lead resistance and contact resistance cause the potential difference between the drive terminal of the readout circuit and the drive terminal of the resistive sensor array module, and also cause the The potential difference between the sampling terminal of the resistive sensor array module, thus destroying the ideal isolation feedback condition of the readout circuit, and making the resistance measurement error of the unit under test larger
Therefore, basically the same lead resistance and different joint contact resistance have a significant impact on the test results of the shared row and column resistive sensor array based on the equipotential method. At the same time, the channel conduction resistance of the multi-way switch in the traditional method will affect the unit under test. How to eliminate the influence of these factors is a problem to be further studied

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resistive Sensor Array Fast Readout Circuit, Readout Method, and Sensing System
  • Resistive Sensor Array Fast Readout Circuit, Readout Method, and Sensing System
  • Resistive Sensor Array Fast Readout Circuit, Readout Method, and Sensing System

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The technical scheme of the present invention is described in detail below in conjunction with accompanying drawing:

[0032] figure 2 It shows the principle of an existing equipotential method fast readout circuit for resistive sensor arrays sharing row and column lines. In the figure, the current resistive sensor R to be tested is xy R in an M×N shared row and column resistive sensor array 11 , image 3 for figure 2 The equivalent diagram of the readout principle of the readout circuit. In this circuit, there is only one connection between each row or column line of the array and the readout circuit. Under the ideal working condition of the circuit, the contact resistance R of all the two-to-one multi-way switches sc , the cumulative resistance R of the lead resistance of the drive connection line and the contact resistance of the connector Lc is ignored so that R xy The voltage of the column line V cy =V xy , the voltage of other column lines is 0; at the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a resistive sensor array fast readout circuit based on a two-wire system isopotential method, and belongs to the sensor technology field. By aiming at an M*N two-dimensional resistive sensor array sharing row lines and column lines, the fast readout circuit comprises a column multiplexer; a reference voltage source; M current feedback operational amplifiers and M testing current sample resistors, which are respectively corresponding to M row lines of the resistive sensor array; N column line driving operational amplifiers, which are respectively corresponding to N column lines of the resistive sensor array; and connecting wires. Each row line and each column line of the resistive sensor array are respectively provided with two connecting wires. The invention also discloses a readout method of the above mentioned fast readout circuit and a sensing system. Compared to the prior art, by adopting the two-wire system isopotential method as the key technology, the measurement errors generated by the connecting cable lead resistance, the cable joint contact resistance, and multi-way switch channel conduction resistance can be effectively eliminated, and therefore the measurement accuracy of the resistive sensor array can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a fast readout circuit of a resistive sensor array. Background technique [0002] The array sensing device is to combine multiple sensing elements with the same performance according to the structure of a two-dimensional array. It can change or generate corresponding shapes and characteristics by detecting changes in parameters focused on the array. This feature is widely used in biosensing, temperature tactile and thermal imaging based on infrared sensors, etc. [0003] Resistive sensor arrays are widely used in infrared imaging simulation systems, force tactile sensing and temperature tactile sensing. Taking temperature touch as an example, since the temperature sensing device involves the transfer of heat and the perception of temperature, in order to obtain the thermal properties of the object, the device puts forward higher requirements for the temperature measurement accur...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01D5/16
CPCG01D5/16
Inventor 吴剑锋何赏赏李建清
Owner SOUTHEAST UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products