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Laser scanning system for laser release

A laser scanning and laser technology, used in lasers, laser welding equipment, laser parts, etc., can solve the problems of product layer damage, reduced product output, and incomplete release of product layers.

Inactive Publication Date: 2017-05-24
M SOLV LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This can lead to incomplete release of the product layer from the carrier layer, potentially causing damage to the product layer and reduced product yield during the manufacturing process

Method used

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  • Laser scanning system for laser release
  • Laser scanning system for laser release
  • Laser scanning system for laser release

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] figure 1 A laser system 8 is depicted which is configured to irradiate the substrate 1 to release the product layer 6 from the carrier layer 2 by irradiating the laser release layer 4 sandwiched between the product layer 6 and the carrier layer 2 . For example, the laser-releasing layer 4 may include a polyimide layer, as described above. For example, product layer 6 may comprise a flexible electrophoretic display or an OLED display. The carrier layer 2 may comprise rigid glass. The laser system 8 may be configured to output radiation having a wavelength in the UV band. Typically, the laser system 8 is implemented using UV excimer lasers according to the prior art. The substrate 1 can be scanned linearly below the laser system 8 (arrow 18).

[0026] Impurities or defects 10 on the surface of the carrier layer 2 can lead to shadowing of regions 12 of the laser-releasing layer 4 . In the arrangement shown, the shaded area is defined by the part of the laser-releasing...

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PUM

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Abstract

The invention relates to a laser scanning system and associated method. In a disclosed arrangement the method comprises using a laser source to produce a laser beam; using a scanning module to scan the laser beam over the surface of a substrate; and using a redirecting unit at a position in a beam path of the laser beam between the scanning module and the substrate to control the direction of incidence of the laser beam onto the substrate, wherein: the laser beam is scanned over a predetermined region on the substrate in such a way that each portion of the region is exposed by the laser beam from a plurality of different directions of incidence.

Description

technical field [0001] The invention relates to a method and a device for scanning a laser on a substrate, in particular for performing laser release of a flexible product layer from a rigid carrier layer. Background technique [0002] It is known to manufacture flexible electronic components (eg flexible electrophoretic displays or OLED displays) by mounting a flexible product layer containing electronic components on a rigid carrier layer. During processing, the connection between the product layer and the carrier layer is maintained by the laser release layer. After processing, the product layer can be released from the carrier layer by suitable irradiation of the laser release layer, usually through the carrier layer. For example, the laser releasing layer may include a polyimide layer. The carrier layer may consist of glass, such as the type of display glass typically used in TFT-LCD fabs. [0003] The use of a rigid carrier layer simplifies the manufacturing process...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B26/10B23K26/082
CPCB23K26/082G02B26/101B23K26/57G02B26/10G03F7/201H01S3/101B23K26/53B23K26/00B23K26/352G02B5/3066G02B27/0927
Inventor D·C·米尔恩P·T·路姆斯比
Owner M SOLV LTD