Heating method suitable for non-flat sheet with film attached

Abstract

The invention discloses a heating method suitable for a non-flat panel to which a film is attached. Mainly, on the basis of a heating cavity composed of an upper cavity component, a lower cavity component and a vacuum generator connected with the upper cavity component and the lower cavity component, and an inlet channel is formed between the lower cavity component and the upper cavity component. When a heating object, namely the non-flat panel to which the film is attached is heated, the upper cavity component is vacuumized through the vacuum generator, and when the upper cavity component is vacuumized to a designated value, the lower cavity component is subjected to vacuum breaking, and therefore the film attached to the non-flat panel is pressed towards and attached to the non-flat panel; then, high-pressure gas is led into the lower cavity component so that the attaching pressure produced when the film is pressed towards and attached to the non-flat panel can be increased; after the designated time is up, the upper cavity component is subjected to vacuum breaking, and the lower cavity component exhausts the high-pressure gas; then, the lower cavity component gets far away from the upper cavity component till the lower cavity component returns to the initial position; and finally, the heated non-flat panel to which the film is attached leaves the inlet channel.

Description

technical field [0001] The invention relates to the technical field of heating equipment, in particular to a heating method suitable for non-flat plates with films attached. Background technique [0002] In the circuit board manufacturing industry, when the board is produced, it is often wrapped with a film for subsequent processing. For some non-flat boards, due to the uneven structure or unevenness of the surface, if the film is to be attached to the non-flat board, the current implementation method is to pre-attach the film non-tightly on the non-flat board. Afterwards, heat the non-flat plate to which the film is attached, so that the film can be completely attached to the non-flat plate after heating. However, most of the heating equipment used in this embodiment is infrared heating equipment, and although this equipment can heat the film to soften it, and then it can be further attached to the uneven plate, but because the film is only softened by heating , and is no...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the defects of the prior art, to provide a heating method suitable for the non-flat plate with the film attached, to solve the problem that the heating equipment in the prior art is difficult to make the film completely adhere to the non-flat plate The problem

Images