Heating method suitable for non-flat sheet with film attached

A heating method and non-flat technology, applied in the field of heating non-flat plates, can solve the problem of the film being completely adhered

Active Publication Date: 2018-01-02
GUANGDONG SOWOTECH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the defects of the prior art, to provide a heating method suitable for the non-flat plate with the film attached, to solve the problem that the heating equipment in the prior art is difficult to make the film completely adhere to the non-flat plate The problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heating method suitable for non-flat sheet with film attached
  • Heating method suitable for non-flat sheet with film attached
  • Heating method suitable for non-flat sheet with film attached

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0053] see Figure 1 to Figure 3 In the following, an embodiment of the heating method suitable for the non-flat plate with the film attached in the present invention will be described.

[0054] The heating method 100 suitable for non-flat boards with films attached in this embodiment is suitable for heating and sticking non-flat boards in the circuit board industry with films. Of course, it can also be applied to non-flat boards in other industries. Heated adhesion of film on flat sheet. Specifically, it includes the following steps:

[0055]S101. Prepare the upper chamber member 10 capable of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a heating method suitable for a non-flat panel to which a film is attached. Mainly, on the basis of a heating cavity composed of an upper cavity component, a lower cavity component and a vacuum generator connected with the upper cavity component and the lower cavity component, and an inlet channel is formed between the lower cavity component and the upper cavity component. When a heating object, namely the non-flat panel to which the film is attached is heated, the upper cavity component is vacuumized through the vacuum generator, and when the upper cavity component is vacuumized to a designated value, the lower cavity component is subjected to vacuum breaking, and therefore the film attached to the non-flat panel is pressed towards and attached to the non-flat panel; then, high-pressure gas is led into the lower cavity component so that the attaching pressure produced when the film is pressed towards and attached to the non-flat panel can be increased; after the designated time is up, the upper cavity component is subjected to vacuum breaking, and the lower cavity component exhausts the high-pressure gas; then, the lower cavity component gets far away from the upper cavity component till the lower cavity component returns to the initial position; and finally, the heated non-flat panel to which the film is attached leaves the inlet channel.

Description

technical field [0001] The invention relates to the technical field of heating equipment, in particular to a heating method suitable for non-flat plates with films attached. Background technique [0002] In the circuit board manufacturing industry, when the board is produced, it is often wrapped with a film for subsequent processing. For some non-flat boards, due to the uneven structure or unevenness of the surface, if the film is to be attached to the non-flat board, the current implementation method is to pre-attach the film non-tightly on the non-flat board. Afterwards, heat the non-flat plate to which the film is attached, so that the film can be completely attached to the non-flat plate after heating. However, most of the heating equipment used in this embodiment is infrared heating equipment, and although this equipment can heat the film to soften it, and then it can be further attached to the uneven plate, but because the film is only softened by heating , and is no...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/14
CPCB29C65/1432
Inventor 王建勋谢军
Owner GUANGDONG SOWOTECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap