Production method for MEMS silicon film

A manufacturing method and technology of silicon film, which is applied in the direction of manufacturing tools, manufacturing microstructure devices, and photolithography on patterned surfaces, etc., can solve the problem of increasing device space, inaccurate size and thickness of silicon film, and difficulty in obtaining accurate thickness and size Silicon film and other issues
CN105645348AInactive Publication Date: 2016-06-08CSMC TECH FAB2 CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CSMC TECH FAB2 CO LTD
Publication Date
2016-06-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a production method for an MEMS silicon film. According to the production method, a silicon dioxide layer is used as an auto-stopping layer, and a method combining drying etching with wet etching is used, thus the silicon film with accurate thickness and size can be produced, and meanwhile the size of the device is also greatly reduced.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor devices, in particular to a method for manufacturing a MEMS silicon film. Background technique

[0002] Many MEMS devices require the use of silicon membranes. For example, a piezoresistive MEMS pressure sensor is composed of a silicon membrane and a stress-sensitive piezoresistor on the silicon membrane. When the silicon membrane is deformed under pressure, the piezoresistive resistance value is changed, and the pressure change can be obtained by measuring the resistance change through a bridge. The size and thickness of the silicon film directly determine the sensitivity of the device. How to prepare a silicon film with precise size and thickness has become one of the key technologies for the development and practical application of MEMS devices, and thus a variety of silicon film preparation technologies have been developed. The simplest technique for preparing a silicon film is to dire...

Claims

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