A semiconductor cooling device for high vacuum environment

A cooling device, semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., to avoid uneven cooling and achieve the effect of cooling
CN105655271BActive Publication Date: 2018-07-03SHENYANG SIASUN ROBOT & AUTOMATION
4 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENYANG SIASUN ROBOT & AUTOMATION
Publication Date
2018-07-03

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to the technical field of semiconductor processing, and specifically discloses a semiconductor cooling device used in a high vacuum environment. The semiconductor cooling device of the present invention comprises a wafer support mechanism (1), a lifting PIN support mechanism (2), a cooling plate mechanism (3), a cooling plate heat insulation support mechanism (4) and a pneumatic lifting mechanism (5), The wafer support mechanism (1), the lifting PIN support mechanism (2), and the cooling plate heat insulation support mechanism (4) are arranged on the cooling plate mechanism (3), and the cooling plate mechanism (3) is arranged on on the pneumatic lifting mechanism (5). The device of the invention realizes the automatic lifting function of the semiconductor and realizes the cooling of the semiconductor. Simultaneously, the invention aims at the realization of the cooling of the over-high temperature after semiconductor processing, and effectively realizes the cooling of the over-high temperature semiconductor.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of wafer processing, in particular to a semiconductor cooling device used in a high vacuum environment. Background technique

[0002] At present, the growth rate of the global semiconductor consumption market and industry is very rapid, especially the growth rate of the domestic semiconductor consumption market and industry is more than 10 times that of the world. Under the extremely fierce competition in the semiconductor industry, the semiconductor industry increasingly needs extremely large-scale integration.

[0003] Semiconductors integrate transportation, processing, and packaging. Due to the requirements of the processing technology, such as improving the production pass rate, the semiconductor will be heated at high temperature during the processing process. If the high-temperature semiconductor is directly packaged, it will damage the semiconductor packaging box and even damage the semiconductor. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More