Semiconductor element and manufacturing method thereof
A manufacturing method and semiconductor technology, applied in the direction of semiconductor devices, electrical components, electric solid devices, etc., can solve the problems of insufficient heat dissipation and light output, and achieve the improvement of heat dissipation performance and light output effect, uniform heat distribution, and slow down aging failure. Effect
Active Publication Date: 2019-02-05
KAISTAR LIGHTING (XIAMEN) CO LTD
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Problems solved by technology
[0003] Based on the above, the circular arrangement is more popular because of its more uniform heat dissipation, better heat dissipation performance, and better light output effect. However, the existing circular arrangement method cannot give full play to its advantages of heat dissipation and light output, so further improvement is needed
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[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0024] The following embodiments of the present invention will propose a high-quality circular arrangement design, which can more fully improve the heat dissipation performance and light output effect of the product. It is worth noting that the [circular arrangement] in the following embodiments of the present invention does not only refer to a completely circular arrangement, but also includes an approximately circular arrangement, such as an ellipse or other irregular circles but The center of each approximate circle is the same point (that is, a common center) or there is a slight deviation in the center; it can be understood here that the complete circle has a single radius, and the approximate circle has multiple different radii. ...
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The invention relates to a semiconductor element and a manufacturing method thereof. The semiconductor element includes a substrate and a plurality of semiconductor chips disposed on the substrate. The plurality of semiconductor chips are arranged to form a plurality of successively nested circles and / or approximate circles, and a plurality of the semiconductor chips are arranged on the circumference of each circle or approximate circle; the plurality of successively nested circles and / or Or the number of semiconductor chips arranged on each circumference of an approximate circle gradually increases from the inside to the outside, and the distance between each circumference gradually decreases from the inside to the outside. The present invention optimizes the arrangement of the semiconductor chips so that the arrangement of the semiconductor chips is loose in the center and denser toward the outside, which is conducive to more uniform heat distribution, thereby slowing down the aging and failure of the semiconductor chips and improving the reliability of the product. Heat dissipation performance and light effect.
Description
technical field [0001] The invention relates to the technical field of semiconductor elements, in particular to a structure of a semiconductor element and a manufacturing method thereof. Background technique [0002] In the technical field of semiconductor components such as light-emitting diode (Light-Emitting Diode, LED) packaging, with the introduction of mirror aluminum substrates and ceramic substrates, the arrangement of LED chips is more diverse. An existing mainstream arrangement method is equidistant arrangement, such as figure 1 As shown, the distances between the LED chips arranged in the circular die-bonding area are equally spaced in both the horizontal axis direction (row direction) and the vertical axis direction (column direction). Another existing mainstream arrangement method is circular arrangement (or non-equidistant arrangement), in which the distance between the LED chips and the LED chips is not equidistant in the horizontal axis direction and the ver...
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IPC IPC(8): H01L33/52H01L33/64F21S2/00
CPCF21S2/005H01L33/52H01L33/642H01L33/486H01L33/64H01L25/0753H01L2933/0075H01L2225/06555H01L2225/06589
Inventor 杨伟洪林升柏黄志伟
Owner KAISTAR LIGHTING (XIAMEN) CO LTD