Non-contact transporting and positioning platform device and control method

Abstract

The invention discloses a non-contact transporting and positioning platform device and a control method. The device comprises a transporting platform, a fixing platform located below the transporting platform, and a base located below the fixing platform. The fixing platform is connected with the base through a fixing platform support. The transporting platform is provided with a plurality of grooves. Each groove is provided with an air inlet hole and an air outlet hole. Each air outlet hole is connected with an air inlet hose. Each air inlet hose is connected with a positive-pressure air source. Each air outlet hole is connected with an air outlet hose, and each air outlet hose is connected with a negative-pressure air source. According to the non-contact transporting and positioning platform device, due to the fact that air is in a horizontal flowing state in the grooves, the airflow viscosity force can be utilized to the maximum degree to drive a workpiece to move, the high motion acceleration is obtained, and complete non-contact can be truly achieved. When airflow makes contact with the semiconductor workpiece, static pollution is not likely to be generated, and stress concentration is not likely to be caused near a contact point.

Description

technical field [0001] The invention relates to a non-contact transportation and positioning platform device and a control method, and belongs to the technical field of non-contact transportation and positioning of semiconductor silicon wafers. Background technique [0002] The new generation of silicon wafer manufacturing requires that it must adopt a frictionless and non-contact method during the production transfer process to ensure that the surface is clean and free from damage. How to realize the safe transportation and positioning of extremely brittle and thin silicon wafers is a very important manufacturing and assembly technology, and a key link to ensure production efficiency and yield. Traditional contact positioning methods (using rollers, suction cups and other contact methods) are likely to cause scratches and cracks on the surface of semiconductor workpieces. At the same time, there are many problems such as static electricity and metal pollution, which cannot ...

AI Technical Summary

Problems solved by technology

[0006] 1) The flow rate of the airflow ejected from the nozzle is small, the driving ability is limited, and the acceleration of the workpiece movement is small; 2) There are horizontal components and vertical components in the oblique airflow, and the vertical component is likely to cause the appearance of unstable disturbance of the workpiece; 3) Electrostatic pollution is likely to occur when the ejected high-speed airflow comes into contact with semiconductor workpieces, and stress concentration is likely to occur near the contact point

4. The air flow direction of the nozzle is limited, which is not conducive to the motion control of the workpiece

[0007] In the prior art, there is also a device that utilizes the viscous force of the airflow to drive the workpiece to move without contact, "an air flotation transportation device" (application publication number is 201410626307.2). Although this method can realize non-contact transportation, it lacks the The pose detection and control function of the system cannot achieve precise positioning of the object. In addition, the drive unit adopts the method of all air supply, which also leads to a significant increase in air consumption

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