A kind of transparent epoxy polyisobutylene potting compound

A polyisobutylene and polyisobutylene resin technology is applied in the field of polymer materials and optoelectronic device packaging, and achieves the effects of good adhesion and sealing, low ionic impurity content in materials, and strong anti-ultraviolet aging ability.

Active Publication Date: 2018-09-14
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the shortage of photoelectric device potting compound including existing lighting LEDs, and provide a transparent epoxy polyisobutylene potting compound

Method used

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  • A kind of transparent epoxy polyisobutylene potting compound
  • A kind of transparent epoxy polyisobutylene potting compound
  • A kind of transparent epoxy polyisobutylene potting compound

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Experimental program
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Embodiment

[0024]

[0025]

[0026] Table 1 Chemical composition of transparent potting compound (parts by mass)

[0027]

[0028] Stir and mix Hybrid-186 and EPIB450 according to the mass parts values ​​listed in Table 1, and ultrasonically disperse to obtain a mixed resin; add antioxidant 1010 and light stabilizer UV531 to the mixed resin; dissolve triphenylphosphine into MHHPA, and then add and mix In the resin, stir evenly to obtain a colorless and transparent potting compound. Apply the potting material to a clean glass slide with a 1mm scraper rod, and heat and cure in an oven. The curing process was heating at 120°C for 4 hours, then heating at 130°C for 2 hours, and finally heating at 150°C for 45 minutes, and cooling with the furnace to obtain samples.

[0029] The transmission spectrum of the sample was measured with a UV-Vis spectrophotometer, and the value at 550 nm was taken as the light transmittance of the sample. The dynamic mechanical properties of the samples...

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Abstract

The invention discloses a transparent epoxy polyisobutene potting material. The material is formed by epoxy low molecular weight polyisobutene resin, nanosilicon dioxide-epoxy hybridized resin, an anhydride curing agent, a curing accelerator and an additive through stirring and mixing, ultrasonic dispersion and heating and curing. The prepared transparent epoxy polyisobutene potting material has the advantages of being low in material ion impurity content, small in water vapor permeation coefficient, high in ultraviolet aging resisting capacity and good in bonding and sealing. The defects of existing illuminating LED containing photoelectric device potting materials are effectively overcome.

Description

technical field [0001] The invention belongs to macromolecular materials and photoelectric device packaging, and in particular relates to a transparent epoxy polyisobutylene potting compound. Background technique [0002] The transparent sealing material used for optoelectronic devices such as solar cells and lighting LED lamps not only needs to provide sealing protection for photovoltaic chips, LED chips, electrical connections, phosphor powder, etc., but also needs to collect solar radiation or extract photons emitted by the chip, giving the product Photoelectric conversion or lighting function. Packaging of solar cells and LED chips is an important link in the production of these optoelectronic devices. Their external quantum efficiency and service life are closely related to package design and package sealing materials. In order to obtain high external quantum efficiency and low light decay speed, the plastic packaging material used must: 1) high light transmittance, r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/26C08L87/00C08K13/02C08G59/42H01L33/56
CPCC08G59/42C08K2201/017C08L23/26C08L2201/08C08L2201/10C08L2203/20H01L33/56C08L87/005C08K13/02
Inventor 李建雄张翔刘安华
Owner SOUTH CHINA UNIV OF TECH
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