Chip positioning device and chip positioning method

Abstract

The invention discloses a chip positioning device and a chip positioning method. The chip positioning device is used for end packaging positioning of chips of an inversion-type multilayer ceramic capacitor. The chip positioning device comprises a first guide plate provided with a plurality of uniformly-arranged first through holes, wherein the length of each first through hole is matched with the width of each chip; a second guide plate provided with a plurality of uniformly-arranged second through holes, wherein the number and distribution positions of the second through holes are matched with those of the first through holes, the length of each second through hole is equal to that of each first through hole, and the width of each second through hole is matched with the thickness of the chip; and a positioning plate provided with a plurality of uniformly-arranged third through holes, wherein the number and distribution positions of the third through holes are matched with those of the second through holes, the length and width of each third through hole are equal to the length and width of each second through hole. The chip positioning device and the chip positioning method can ensure correct positioning orientation of the chips of the inversion-type multilayer ceramic capacitor during end packaging, can improve end packaging efficiency and is convenient to operate.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a chip positioning device and a chip positioning method for end-sealing positioning of chips of flip-chip multilayer ceramic capacitors. Background technique [0002] Flip-chip multilayer ceramic capacitors are a kind of specially designed multilayer ceramic capacitors. The specifications include 0204, 0306, 0508, 0612, etc. The difference from conventional multilayer ceramic capacitors is that the length and width of the capacitor chip are reversed. For example, the flip-chip multilayer ceramic capacitor corresponding to the 0402 specification (0.04 inches in length and 0.02 inches in width) of a conventional multilayer ceramic capacitor is the 0204 specification (0.02 inches in length and 0.04 inches in width). The flip-chip multilayer ceramic capacitor has a greatly reduced aspect ratio compared with conventional products, so the equivalent series inductance is greatly red...

AI Technical Summary

Problems solved by technology

[0004] However, when the chip of the flip-chip multilayer ceramic capacitor is introduced into the plate hole of the terminal board, the problem of wrong orientation of the chip is prone to occur, so that the terminal electrodes are mistakenly formed on the two opposite short sides of the chip, so the flip-chip Type multilayer ceramic capacitors have low chip termination efficiency

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