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37results about How to "High end-capping efficiency" patented technology

Low-hardness and high-elasticity water treatment membrane component epoxy pouring sealant preparation method and application

The invention discloses a low-hardness and high-elasticity water treatment membrane component epoxy pouring sealant preparation method and application. An epoxy pouring sealant comprises a component Aand a component B, the component A comprises, by weight, 30-70 parts of epoxy resin, 5-20 parts of activated thinners, 10-20 parts of toughening agents, 5-30 parts of fillers and 0.1-3 parts of coupling agents, the component B comprises, by weight, 20-50 parts of polyether amine, 40-70 parts of alicyclic amine and 2-15 parts of curing accelerators, and the weight ration of the component A to thecomponent B is (100:10)-(100:50). By the aid of a 'trinity' toughening modified mode of the flexible toughening agents, the activated toughening thinners and flexible curing agents, the epoxy pouringsealant is characterized of low hardness, high elasticity and stable hardness within wide temperature range, the epoxy pouring sealant has excellent adhesive performance and is low in initial viscosity, high in mold filling speed, simple and convenient to operate and applicable to the fields such as package of water treatment membrane components and flexible package of electronic devices, and theblocking efficiency of the membrane components can be greatly improved.
Owner:浙江航通舟新材料科技股份有限公司

End-functionalized rubber as well as preparation method and application thereof

The invention discloses end-functionalized rubber as well as a preparation method and an application thereof. According to the method, a polarized organic compound is taken as a modifier, organolithium is taken as an initiator, and conjugated diene or/and vinyl aromatic hydrocarbon is/are initiated to be subjected to anionic polymerization in a hydrocarbon solvent for synthesis of an active polymer; the active polymer is subjected to a reaction with a diphenylethlene capping agent, and a capped active polymer is obtained; the capped active polymer is subjected to a terminating reaction with a novel siloxane-containing aromatic imine terminating agent, and functionalized rubber with a siloxy-amido group as an end group is prepared; finally, the synthesized end-functionalized rubber is mixed with complexing agents including a reinforcing agent, a vulcanizing agent, an accelerant and the like, a rubber composite is prepared and vulcanized, and a rubber material with low rolling resistance, high slipping resistance and other performance is obtained. The end-functionalized rubber synthesized with the method and the rubber material prepared from the end-functionalized rubber have good interaction with carbon black/white carbon black and can be applied to the tire industry.
Owner:DALIAN MARITIME UNIVERSITY

Steel pipe end sealing device and using method

The invention discloses a steel pipe end sealing device, and relates to the technical field of machining. The steel pipe end sealing device comprises a rack arranged on a plane and a conveying devicearranged inside the rack, wherein the conveying device comprises a sliding base arranged inside the rack, a clamping wheel plate arranged inside the rack and a fixing device arranged above the rack, the fixing device comprises a placing frame arranged above the rack, telescopic motors arranged on the placing frame, a fixing base arranged inside the placing frame, a semicircular arc-shaped surfaceis formed in the fixing base and a pushing and pressing device arranged on one side of the rack and fixedly connected with the rack, and the pushing and pressing device comprises a butt joint pipe arranged on the outer side of the rack, an end sealing cover arranged inside the butt joint pipe and a pushing and pressing air cylinder arranged on one side of the butt joint pipe. According to the steel pipe end sealing device and the using method, the problems that high firmness cannot be kept and the sleeving efficiency is low when an end sealing sleeve manually sleeves an end port of a steel pipe, and the end sealing sleeve is easily caused to fall off are prevented.
Owner:ZHANGJIAGANG CITY SHENGDINGYUAN PIPE MAKING

Straw plate producing and processing system

A straw plate producing and processing system comprises a main production system and a material recycling and dust removing system. The material recycling and dust removing system is arranged at the upper end of the main production system. The main production system is composed of a straw supplying and feeding module, an unbundling module, a stepping separation module, a straw conveying module, a forming module, a conveying module, a cut-off module and an end sealing module. The material recycling and dust removing system is composed of a material recycling module and a dust removing module. The straw supplying and feeding module, the unbundling module, the stepping separation module, the straw conveying module, the forming module, the conveying module, the cut-off module and the end sealing module are sequentially connected from left to right. The material recycling module is connected with the dust removing module. The straw plate producing and processing system is reasonable in overall system device matching, good in continuity and high in transfer efficiency; and in the production process, no auxiliary materials need to be added, straw plates are completely formed by processing straw, and the high-quality, high-strength and purely-natural straw plates can be produced.
Owner:高唐融知融智科技服务有限公司

Chip positioning apparatus and chip positioning method

The invention discloses a chip positioning apparatus and a chip positioning method. The chip positioning apparatus comprises the following steps: a guide plate having a plurality of first through holes in uniform arrangement, the length and width of each first through hole matching the length and thickness of a chip; a positioning plate having a plurality of second through holes in uniform arrangement, the number and distribution position of the plurality of second through holes matching those of the plurality of first through holes, the width of each second through hole equal to that of each first through hole, the length of each second through hole greater than that of each first through hole, and the length of each second through hole greater than the sum of the length and the width of the chip, the depth of each second through hole no smaller than one third of the length of the chip and the depth of each second through hole no greater than half of the length of the chip; and a cross bar having a length greater than the width of the positioning plate. The chip positioning apparatus can guarantee correct orientation of the chip of an inverted multi-layer ceramic capacitor upon end termination, can increase efficiency of end termination, and is easy to operate.
Owner:GUANGDONG FENGHUA ADVANCED TECH HLDG

Chip positioning device and chip positioning method

The invention discloses a chip positioning device and a chip positioning method. The chip positioning device is used for end encapsulation positioning of the chips of inverted type multi-layer ceramic capacitors. The chip positioning device includes a first guide plate with a plurality of uniformly-arranged first through holes, a second guide plate with a plurality of uniformly-arranged second through holes, and a positioning plate with a plurality of uniformly-arranged third through holes; the length and width of the first through holes are matched with the length and thickness of the chips; the number and distribution positions of the second through holes are matched with the number and distribution positions of the first through holes; the width of the second through holes is equal to the width of the first through holes; the depth of the second through holes is larger than the width of the chips; the number and the distribution positions of the third through holes are matched with the number and the distribution positions of the second through holes; and the width of the third through holes is equal to the width of the second through holes. With the chip positioning device and the chip positioning method adopted, the orientation of the positioning of the chips of the inverted type multi-layer ceramic capacitors in end encapsulation can be ensured, end encapsulation efficiency can be improved, and operation is convenient.
Owner:GUANGDONG FENGHUA ADVANCED TECH HLDG

Intelligent end sealing clamp for high-precision electronic component and machining process of intelligent end sealing clamp

The invention discloses a high-precision electronic component intelligent end sealing clamp and a machining process thereof, and belongs to the field of electronic component machining. According to the intelligent end sealing clamp for the high-precision electronic component and the machining technology of the intelligent end sealing clamp, three-shaft end sealing plates are installed in the middle of the interior of a workbench frame and the middle of the interior of a lower fixing frame correspondingly, a through opening is formed in the middle of the interior of the workbench frame, and a positioning sensor is installed on the inner wall of the through opening; and feeding and discharging rolling wheels are installed in the grooves, and positioning clamp bases are installed on the two sides of the workbench frame correspondingly. The problems that in the prior art, an electronic component clamp is simple in positioning mode, the position of the clamp is not convenient to adjust intelligently, and adaptability is poor are solved, the position of a component can be sensed through the positioning sensor, the two three-shaft end sealing plates can be adjusted to achieve the optimal positioning effect, the positions of feeding and discharging rolling wheels are adjusted intelligently, and the production efficiency is improved. And the end sealing device is stable in structure and convenient to regulate and control.
Owner:东莞市东城金祥泰工业设计服务中心

High-stability water-soluble coenzyme Q10 inclusion compound and preparation method thereof

The invention provides a high-stability water-soluble coenzyme Q10 inclusion compound. A preparation method comprises the following steps: heating a water-soluble coenzyme Q10 inclusion compound aqueous solution to 10-90 DEG C, adding a cross-linking agent, performing stirring reaction for 1-20 hours, and performing filtration and drying to obtain the high-stability water-soluble coenzyme Q10 inclusion compound. In the water-soluble coenzyme Q10 inclusion compound aqueous solution, an inclusion wall material of coenzyme Q10 is a starch wall material, and the content of water is 50-95% of the mass of the water-soluble coenzyme Q10 inclusion compound aqueous solution; and the addition amount of the cross-linking agent is 0.0005-0.02% of the mass of the water-soluble coenzyme Q10 inclusion compound aqueous solution. According to the invention, through an end group treatment mode of promoting cross-linking between hydrophilic end groups -OH outside the starch wall material through the cross-linking agent containing polyfunctional groups, an inlet port of the starch wall material is effectively terminated, the use stability of the water-soluble coenzyme Q10 inclusion compound is greatlyimproved, and the application field of the water-soluble coenzyme Q10 inclusion compound is further expanded.
Owner:上海融澈水性材料有限公司

Chip positioning device and chip positioning method

The invention discloses a chip positioning device and a chip positioning method. The chip positioning device is used for end packaging positioning of chips of an inversion-type multilayer ceramic capacitor. The chip positioning device comprises a first guide plate provided with a plurality of uniformly-arranged first through holes, wherein the length of each first through hole is matched with the width of each chip; a second guide plate provided with a plurality of uniformly-arranged second through holes, wherein the number and distribution positions of the second through holes are matched with those of the first through holes, the length of each second through hole is equal to that of each first through hole, and the width of each second through hole is matched with the thickness of the chip; and a positioning plate provided with a plurality of uniformly-arranged third through holes, wherein the number and distribution positions of the third through holes are matched with those of the second through holes, the length and width of each third through hole are equal to the length and width of each second through hole. The chip positioning device and the chip positioning method can ensure correct positioning orientation of the chips of the inversion-type multilayer ceramic capacitor during end packaging, can improve end packaging efficiency and is convenient to operate.
Owner:GUANGDONG FENGHUA ADVANCED TECH HLDG

Preparation and application of a low-hardness and high-elasticity epoxy potting adhesive for water treatment membrane components

The invention discloses the preparation and application of epoxy potting adhesive for water treatment membrane components with low hardness and high elasticity. The epoxy potting glue includes A component and B component, and the A component includes 30-70 parts of epoxy resin; 5-20 parts of reactive diluent; 10-20 parts of toughening agent; 5-30 parts of filler; 0.1 to 3 parts of coupling agent; B component includes 20 to 50 parts of polyetheramine; 40 to 70 parts of alicyclic amine; 2 to 15 parts of curing accelerator; the weight ratio of the A component and the B component is 100 :10~100:50. The present invention realizes the characteristics of low hardness, high elasticity and stable hardness of the epoxy potting glue through the "trinity" toughening modification method of flexible toughening agent, active toughening diluent and flexible curing agent ; and while the epoxy potting glue has excellent bonding performance, it has low initial viscosity, fast mold filling speed, and easy operation, which can greatly improve the sealing efficiency of the membrane module, and is suitable for the packaging of water treatment membrane modules and the flexibility of electronic devices. Packaging and other fields.
Owner:浙江航通舟新材料科技股份有限公司

Chip positioning device and chip positioning method

The invention discloses a chip positioning apparatus and a chip positioning method. The chip positioning apparatus comprises the following steps: a guide plate having a plurality of first through holes in uniform arrangement, the length and width of each first through hole matching the length and thickness of a chip; a positioning plate having a plurality of second through holes in uniform arrangement, the number and distribution position of the plurality of second through holes matching those of the plurality of first through holes, the width of each second through hole equal to that of each first through hole, the length of each second through hole greater than that of each first through hole, and the length of each second through hole greater than the sum of the length and the width of the chip, the depth of each second through hole no smaller than one third of the length of the chip and the depth of each second through hole no greater than half of the length of the chip; and a cross bar having a length greater than the width of the positioning plate. The chip positioning apparatus can guarantee correct orientation of the chip of an inverted multi-layer ceramic capacitor upon end termination, can increase efficiency of end termination, and is easy to operate.
Owner:GUANGDONG FENGHUA ADVANCED TECH HLDG
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