Low-hardness and high-elasticity water treatment membrane component epoxy pouring sealant preparation method and application

A technology of water treatment film and potting glue, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of high brittleness of epoxy resin, failure to achieve flexible packaging, and harsh use conditions, etc., and achieve excellent Adhesiveness, excellent protection performance, effect of improving compatibility

Active Publication Date: 2018-12-25
浙江航通舟新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyurethane potting glue has good flexibility, can reduce the fracture of the end of the membrane filament, and has the advantages of low viscosity and fast curing speed, but the isocyanate group in the polyurethane potting glue is very easy to react with water, and the cured product Air bubbles reduce sealing, so its use conditions are more severe
Epoxy resin has excellent adhesion, mechanical strength and corrosion resistance, and is cost-effective. However, epoxy resin is brittle and easy to cause broken wires, so toughening modification is required
In related patents in the field, a variety of toughening agents are applied to epoxy resin potting adhesives, such as liquid rubber (patent CN201210256771.8), low-molecular polyurethane or polyol glycidyl ether (CN201410606987.1), rubber / dipolymer Acid / polyurethane-modified epoxy resin (CN201611229888.1, CN201710552507.1), but the hardness of the epoxy resin cured product described in each technical solution is only Shore hardness A70-A80 at the lowest, which does not reach the real flexible packaging

Method used

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  • Low-hardness and high-elasticity water treatment membrane component epoxy pouring sealant preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] 70 parts by weight of E-51, 8 parts by weight of butyl glycidyl ether, 10 parts by weight of epoxy-terminated polyurethane, 9.9 parts by weight of talc, 0.1 parts by weight of KH-550, 2 parts by weight of polyoxygen Ethylene polyoxypropylene pentaerythritol ether was mixed and stirred evenly to obtain component A; 50 parts by weight of polyetheramine D400, 40 parts by weight of Baxxodur EC252, 10 parts by weight of 2,4,6-tris(dimethylaminomethyl) Mix phenol with light and stir component B; mix component A and component B at a weight ratio of 100:50 and stir evenly to obtain a low-hardness and high-elasticity epoxy potting glue.

Embodiment 2

[0047]50 parts by weight of E-51, 10 parts by weight of benzyl glycidyl ether, 10 parts by weight of o-cresyl glycidyl ether, 20 parts by weight of epoxy-terminated polyurethane, 6.9 parts by weight of titanium dioxide, 3 parts by weight of KH-570, 0.1 parts by weight of glycerol polyether stearic acid triester were mixed and stirred evenly to obtain component A; 20 parts by weight of Baxxodur EC310, 70 parts by weight of Baxxodur EC210, 10 parts by weight of 2,4,6- Mix tri(dimethylaminomethyl)phenol with light and stir component B; mix and stir components A and B at a weight ratio of 100:20 to obtain a low-hardness and high-elasticity epoxy potting glue.

Embodiment 3

[0049] 30 parts by weight of E-44, 10 parts by weight of 1,4-butanediol diglycidyl ether, 8 parts by weight of ethylene glycol diglycidyl ether, 20 parts by weight of epoxy-terminated polyethylene glycol, 30 parts by weight of fumed silica, 1 part by weight of KH-560, and 1 part by weight of nonylphenol polyoxyethylene ether were mixed and stirred evenly to obtain component A; 40 parts by weight of D2000, 45 parts by weight of TAC-900 , 10 parts by weight of 2,4,6-tris-2-ethylhexanoate of 6-tris(dimethylaminomethyl)phenol, 5 parts by weight of salicylic acid mixed with light and stirring component B; group A Part and B component are mixed and stirred evenly at a weight ratio of 100:10 to obtain a low-hardness and high-elasticity epoxy potting glue.

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Abstract

The invention discloses a low-hardness and high-elasticity water treatment membrane component epoxy pouring sealant preparation method and application. An epoxy pouring sealant comprises a component Aand a component B, the component A comprises, by weight, 30-70 parts of epoxy resin, 5-20 parts of activated thinners, 10-20 parts of toughening agents, 5-30 parts of fillers and 0.1-3 parts of coupling agents, the component B comprises, by weight, 20-50 parts of polyether amine, 40-70 parts of alicyclic amine and 2-15 parts of curing accelerators, and the weight ration of the component A to thecomponent B is (100:10)-(100:50). By the aid of a 'trinity' toughening modified mode of the flexible toughening agents, the activated toughening thinners and flexible curing agents, the epoxy pouringsealant is characterized of low hardness, high elasticity and stable hardness within wide temperature range, the epoxy pouring sealant has excellent adhesive performance and is low in initial viscosity, high in mold filling speed, simple and convenient to operate and applicable to the fields such as package of water treatment membrane components and flexible package of electronic devices, and theblocking efficiency of the membrane components can be greatly improved.

Description

technical field [0001] The invention relates to an adhesive, in particular to the preparation and application of a low-hardness and high-elasticity epoxy potting glue for water treatment membrane components. Background technique [0002] With the development of society and economy, human beings consume more and more water resources, and problems such as shortage of fresh water resources and water pollution are becoming more and more serious. Membrane water treatment technology is an energy-saving and high-efficiency purification technology. Its process uses a selectively permeable membrane as the separation medium. When there are driving forces such as pressure and concentration differences on both sides of the membrane, its uniform pore size is used to intercept water. Particles, bacteria and other substances to achieve the purpose of separation and purification. Hollow fiber membrane is a kind of separation membrane with high surface area, fibrous shape and self-supportin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/50
CPCC08G59/5026C09J163/00
Inventor 胡宏军朱增裕
Owner 浙江航通舟新材料科技股份有限公司
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