Chip positioning device and chip positioning method

A positioning device and a positioning method technology, applied in terminal application devices, packaging capacitor devices, capacitor manufacturing, etc., can solve the problems of wrong chip positioning and low sealing efficiency, etc.

Active Publication Date: 2018-06-26
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when the chip of the flip-chip multilayer ceramic capacitor is introduced into the plate hole of the terminal board, the problem of wrong orientation of the chip is prone to occur, so that the terminal electrodes are mistakenly formed on the two opposite short sides of the chip, so the flip-chip Type multilayer ceramic capacitors have low chip termination efficiency

Method used

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  • Chip positioning device and chip positioning method
  • Chip positioning device and chip positioning method
  • Chip positioning device and chip positioning method

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Embodiment Construction

[0034] The chip positioning device and the chip positioning method used for the end-sealing positioning of the chip of the flip-chip multilayer ceramic capacitor will be further described in detail below mainly in conjunction with the accompanying drawings and specific embodiments.

[0035] combine figure 2 , the surface formed by the length (L) and width (W) of the chip 200 of the flip-chip multilayer ceramic capacitor is the main surface, and the surface formed by the length (L) and thickness (T) of the chip 200 is the short side, and the surface of the chip 200 The surfaces formed by width (W) and thickness (T) are long sides. Terminal electrodes of the flip-chip multilayer ceramic capacitor are formed on opposite long sides of the chip 200 .

[0036] combine Figure 3 ~ Figure 4 , the chip positioning device of an embodiment used for the terminal sealing positioning of the chip 200 of the flip-chip multilayer ceramic capacitor includes: a guide plate 10 , a positioning ...

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Abstract

The invention discloses a chip positioning apparatus and a chip positioning method. The chip positioning apparatus comprises the following steps: a guide plate having a plurality of first through holes in uniform arrangement, the length and width of each first through hole matching the length and thickness of a chip; a positioning plate having a plurality of second through holes in uniform arrangement, the number and distribution position of the plurality of second through holes matching those of the plurality of first through holes, the width of each second through hole equal to that of each first through hole, the length of each second through hole greater than that of each first through hole, and the length of each second through hole greater than the sum of the length and the width of the chip, the depth of each second through hole no smaller than one third of the length of the chip and the depth of each second through hole no greater than half of the length of the chip; and a cross bar having a length greater than the width of the positioning plate. The chip positioning apparatus can guarantee correct orientation of the chip of an inverted multi-layer ceramic capacitor upon end termination, can increase efficiency of end termination, and is easy to operate.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a chip positioning device and a chip positioning method for end-sealing positioning of chips of flip-chip multilayer ceramic capacitors. Background technique [0002] Flip-chip multilayer ceramic capacitors are a kind of specially designed multilayer ceramic capacitors. The specifications include 0204, 0306, 0508, 0612, etc. The difference from conventional multilayer ceramic capacitors is that the length and width of the capacitor chip are reversed. For example, the flip-chip multilayer ceramic capacitor corresponding to the 0402 specification (0.04 inches in length and 0.02 inches in width) of a conventional multilayer ceramic capacitor is the 0204 specification (0.02 inches in length and 0.04 inches in width). The flip-chip multilayer ceramic capacitor has a greatly reduced aspect ratio compared with conventional products, so the equivalent series inductance is greatly red...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G13/00
CPCH01G13/003H01G13/006
Inventor 陆亨刘兰兰廖庆文伍尚颖安可荣宋子峰
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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