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Color-temperature-adjustable COB packaging structure and packaging method thereof

A technology of packaging structure and color temperature, applied in electrical components, electric solid devices, circuits, etc., can solve the problems of reducing the lighting effect of LED light sources with adjustable color temperature, difficult to accurately control color temperature, complex production process, etc., to achieve saving The effect of package area, uniform light spot, and simple production process

Inactive Publication Date: 2016-09-28
ZHONGSHAN LITI LIGHTING TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] It is difficult to accurately control the color temperature of the above-mentioned COB light source with adjustable color temperature, and the production process is relatively complicated; at the same time, LED chips with different color temperatures are located in different areas, and the LED chips will produce uneven light spots when they are lit, which reduces the possible The lighting effect of LED light source with color temperature

Method used

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  • Color-temperature-adjustable COB packaging structure and packaging method thereof
  • Color-temperature-adjustable COB packaging structure and packaging method thereof

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Embodiment Construction

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention and the accompanying drawings. It should be noted that the described embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] The specific implementation manner of the present invention will be described below in conjunction with the accompanying drawings.

[0021] Such as figure 1 and figure 2 As shown, the COB packaging structure with adjustable color temperature in the present invention includes a packaging subs...

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Abstract

The invention discloses a color-temperature-adjustable COB packaging structure and a packaging method thereof. The color-temperature-adjustable COB packaging structure comprises a packaging substrate, CSP chip scale packaging devices, LED chips and a florescent glue sealing layer. The CSP chip scale packaging devices and the LED chips are fixed on the packaging substrate and wrapped by the florescent glue sealing layer. The florescent glue sealing layer is internally provided with at least one CSP chip scale packaging device and the LED chip, wherein the CSP chip scale packaging devices comprise chips and florescent glue wrapping the chips. The florescent glue and the florescent glue sealing layer are different in phosphor concentration. Light emitted by the CSP chip scale packaging devices and the LED chips passes through different numbers of phosphor powder particles and then color of different color temperature is obtained. The effect of color temperature adjustment can be achieved by controlling driving current in the CSP chip scale packaging devices and the LED chips.

Description

technical field [0001] The invention relates to an LED package structure, in particular to a COB package structure with adjustable color temperature and a package method thereof. Background technique [0002] COB light sources can be used for light source modules with small light emitting surfaces. In order to achieve adjustable color temperature of COB light sources, LED chips coated with different fluorescent materials on the surface are usually distributed in multiple different areas to achieve adjustable color temperature. [0003] It is difficult to accurately control the color temperature of the above-mentioned COB light source with adjustable color temperature, and the production process is relatively complicated; at the same time, LED chips with different color temperatures are located in different areas, and the LED chips will produce uneven light spots when they are lit, which reduces the possible The lighting effect of the LED light source with color temperature. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50
CPCH01L25/0753H01L33/486H01L33/508H01L2933/0041
Inventor 程胜鹏许瑞龙刘火奇
Owner ZHONGSHAN LITI LIGHTING TECH
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