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Mems structure with rounded edge brake and method of making the same

A technology of brakes and rounded edges, which is used in the manufacture of microstructure devices, microstructure devices composed of deformable elements, and microstructure technology, and can solve problems such as not being fully satisfied.

Active Publication Date: 2018-08-31
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While existing technologies for preventing stiction are adequate, they are not yet adequate in all respects

Method used

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  • Mems structure with rounded edge brake and method of making the same
  • Mems structure with rounded edge brake and method of making the same
  • Mems structure with rounded edge brake and method of making the same

Examples

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Embodiment Construction

[0011] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to limit the invention. For example, in the following description, forming a first part over or on a second part may include embodiments in which the first part and the second part are formed in direct contact, and may also include an embodiment in which the first part and the second part are formed in between. An embodiment where the additional part is such that the first part and the second part are not in direct contact. Additionally, the invention may repeat reference numerals and / or characters in multiple instances. This repetition is for the purposes of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or conf...

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Abstract

The present invention provides a method of fabricating a MEMS device, comprising forming a plurality of round-edged trenches on a sacrificial layer over a carrier substrate. Then, a polysilicon layer is formed over the sacrificial layer to fill the trench. A plurality of detents are defined by the trenches and protrude from the polysilicon layer toward the carrier substrate. Subsequently, a portion of the sacrificial layer is removed to define a recess between the polysilicon layer and the carrier substrate and expose the stopper. The invention also provides a MEMS structure with a round edge stopper and a method of manufacturing the same.

Description

technical field [0001] Embodiments of the present invention generally relate to the field of semiconductor technology, and more particularly, to MEMS and methods of manufacturing the same. Background technique [0002] The functional density of integrated circuits (ICs) never ceases to increase, enabling even more components to be accommodated per chip area. The size of the components must decrease as the evolution progresses. Downsizing necessarily comes with complexity in design and manufacturing. [0003] These advances are made possible with the advent of wafer-level packaging of microelectromechanical systems (MEMS) devices. MEMS devices offer new vistas of what integrated circuits can achieve, including power generation, light projection, force sensing, switching, and combinations of new materials and processes. Since the MEMS device contains multiple substrates, the supports of the MEMS device are relatively bonded. In the presence of movable components, protectiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00B81B7/02
CPCB81B7/02B81C1/00B81B3/001
Inventor 詹志仁吴常明
Owner TAIWAN SEMICON MFG CO LTD
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