Quad flat no-lead (QFN) package image sheet automatic alignment method

An automatic alignment, square and flat technology, applied in the direction of semiconductor/solid-state device testing/measurement, can solve the problems of low processing efficiency, waste of manpower, waste of processing area, etc., and achieve the effect of good alignment accuracy and high efficiency

Active Publication Date: 2016-11-23
SUZHOU VEGA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the processing of QFN packaged graphics chips generally adopts a single-chip processing mode, but for some smaller QFN packaged graphics chips, the single-chip processing mode greatly wastes the processing area and manpower. The processing method also has the disadvantage of low processing efficiency.

Method used

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  • Quad flat no-lead (QFN) package image sheet automatic alignment method
  • Quad flat no-lead (QFN) package image sheet automatic alignment method
  • Quad flat no-lead (QFN) package image sheet automatic alignment method

Examples

Experimental program
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Effect test

Embodiment approach 1

[0053] Embodiment 1 further includes step S7, rotating the table 20 and calculating the rotated coordinates of the P7 point according to the above angle value, aligning the P7 point at the coordinates and saving the alignment result.

Embodiment approach 2

[0054] Embodiment 2 also includes the following steps: S7, at least one step X is taken along the negative direction of the X axis at point P7 to return to point P6, and three steps Y and one step are taken along the positive direction of the Y axis at point P6 Enter M, get the actual alignment position and define it as P8 point, and save the alignment result;

[0055] S8, walk at least one step X along the positive direction of the X-axis at point P8 and perform alignment, obtain the actual alignment position and define it as point P9, and save the alignment result;

[0056] S9, calculate the angle value of these two points according to the position of P8 point and P9 point, and save this angle value;

[0057] S10, equally divide the angle value obtained in step S6 and the angle value obtained in step S9 to each corresponding chip block.

[0058] Specifically, the step S8 is as follows: take three steps X along the positive direction of the X-axis at the point P8 and perform...

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Abstract

The invention provides a quad flat no-lead (QFN) package image sheet automatic alignment method, which is used for a scribing machine to cut chip blocks on a QFN package image sheet. The QFN package image sheet automatic alignment method mainly comprises the following steps: S1) defining X-axis and Y-axis directions, defining stepping X and stepping Y of each chip block in the X-axis direction and Y-axis direction respectively, moving the QFN package image sheet along the X-axis and Y-axis directions to a starting point theoretic alignment position for alignment, and after alignment, obtaining a starting point alignment actual position and defining the starting point alignment actual position as a P1 point; S2) moving from the P1 point along the X-axis positive direction by at least one stepping X and carrying out alignment, obtaining an alignment actual position and defining the alignment actual position as a P2 point, and keeping the alignment result; and S3) calculating angle values of the two points according to the positions of the P1 point and the P2 point, rotating a working platform and calculating the coordinate of the P2 obtained after rotation, and carrying out alignment on the P2 at the coordinate to obtain an alignment actual position and keeping the alignment result.

Description

technical field [0001] The invention relates to an automatic alignment method, in particular to an automatic alignment method for a quad flat no-lead (QFN) packaging graphic sheet. Background technique [0002] At present, the dicing machine is divided into: 6 inches, 8 inches, 12 inches, etc. according to the processing area. In the prior art, the processing of QFN packaged graphics chips generally adopts a single-chip processing mode, but for some smaller QFN packaged graphics chips, the single-chip processing mode greatly wastes the processing area and manpower. The processing method also has the disadvantage of low processing efficiency. [0003] In view of this, it is necessary to improve the existing processing mode to solve the above problems. Contents of the invention [0004] The purpose of the present invention is to provide a method for automatic alignment of square flat no-lead (QFN) package graphics chips, which can not only realize the automatic alignment o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
Inventor 夏凡王克江赵葵
Owner SUZHOU VEGA TECH CO LTD
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