Semiconductor device and manufacturing method thereof
A semiconductor and carrier technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as high cost and high complexity
Active Publication Date: 2016-11-30
AMKOR TECH INC
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Problems solved by technology
[0003] Current methods for forming various semiconductor devices, such as those including an interposer with through-silicon vias (TSVs), are deficient, for example, by utilizing highly complex and / or costly processes
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[0028] The following discussion presents various features of the disclosure by providing examples of the disclosure. Such examples are not limiting, and thus the scope of the various features of this disclosure should not be necessarily limited to any particular feature of the examples provided. In the following discussion, the words "for example," "for example," and "exemplary" are not limiting, and are roughly the same as "exemplary and non-limiting," "such as and non-limiting," and the like is synonymous.
[0029] As used herein, "and / or" means any one or more of the items added by "and / or" in the list. For example, "x and / or y" means any element in the set of three elements {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y". As another example, "x, y, and / or z" means the set {(x), (y), (z), (x, y), (x, z), ( y,z), any element in (x,y,z)}. In other words, "x, y and / or z" means "one or more of x, y and z".
[0030] The terminology used here...
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A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
Description
[0001] Cross-Reference / Incorporation by Reference to Related Applications [0002] This application refers to Korean Patent Application No. 10-2015-0037481 filed with the Korea Intellectual Property Office on March 18, 2015 and is entitled "Semiconductor Device and Manufacturing Method Thereof", claims its priority, and claims its benefit, the content of this Korean patent application is hereby incorporated by reference in its entirety. Background technique [0003] Current methods for forming various semiconductor devices, such as including an interposer with through-silicon vias (TSVs), are deficient, eg, utilizing highly complex and / or costly processes. Further Limitations and Disadvantages of Known and Conventional Approaches To those skilled in the art, a comparison of this approach with the present disclosure as set forth in the remainder of this application with reference to the drawings will becomes obvious. Contents of the invention [0004] Various features of th...
Claims
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IPC IPC(8): H01L23/538H01L21/50H01L23/498
CPCH01L24/81H01L24/83H01L23/49822H01L23/3128H01L24/32H01L23/5389H01L21/4853H01L23/49816H01L21/4857H01L21/6835H01L21/568H01L21/561H01L24/92H01L24/11H01L24/97H01L24/16H01L24/13H01L2224/8191H01L2224/16227H01L2224/133H01L2224/83H01L2224/131H01L2221/68318H01L2224/81447H01L2224/81444H01L2224/83104H01L2224/81005H01L2224/81203H01L2224/16238H01L2221/68345H01L2924/15311H01L2221/68304H01L2224/32225H01L2224/92125H01L2224/81192H01L2224/16237H01L2224/81913H01L2224/81914H01L2224/81911H01L2224/81439H01L2221/68331H01L2224/81464H01L2924/14335H01L2224/13294H01L2924/1815H01L2224/1132H01L2224/83005H01L2224/81224H01L2224/81424H01L2221/68363H01L2224/97H01L2224/83192H01L2224/73204H01L2224/92H01L2224/81815H01L2224/9202H01L2924/1421H01L2924/1433H01L2924/15331H01L2924/18161H01L2224/81H01L2924/00014H01L2924/014H01L2924/00012H01L21/56H01L2224/16225H01L2924/00
Inventor 金东吉金吉翰杜文秋贝杰翰其王门翰东和金杜浑李吉和朴金文孙山南邱翰可提斯·斯文格
Owner AMKOR TECH INC