Method for reducing the false negative rate of hot spot detection in chemical mechanical polishing process

Abstract

A method for reducing hotspot detection failure report rate of a chemical mechanical polishing process comprises the following steps of 1, executing layout loading; 2, selecting the size of a lattice point, and calculating the moving frequency of a single direction in two vertical moving directions according to a set moving step length of an initial point; 3, moving a cutting initial point (X, Y) of the layout according to [(X-m*s), (Y-n*s)], wherein s is the moving step length of the initial point, m and n are integers, and initial values of the m and the n are moving frequencies of the single direction; 4, executing geometrical information extraction of the lattice point; 5, executing simulation and forecast of the chemical mechanism polishing process; 6, executing hotspot detection; and 7, allowing the n to be increased by 1, and repeating the step 3 to the step 6 when the n after being increased by 1 is smaller than the moving frequency of the single direction, or allowing the m to be increased by 1, allowing the n to be increased by 1 when the m after being increased by 1 is smaller than the moving frequency of the single direction, and repeating the step 3 to the step 6 when the n after being increased by 1 is smaller than the moving frequency of the single direction.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, and more specifically, the invention relates to a method for reducing the false alarm rate of hot spot detection in a chemical mechanical polishing process. Background technique [0002] In the hot spot detection process of the existing chemical mechanical polishing process, it usually includes such as figure 1 process shown. Before the geometric information is extracted, the layout needs to be cut into several grid points according to a certain size. The starting point of layout cutting is fixed to the lower left corner of the layout window (fixed starting point cutting). During the cutting process, those graphics at the intersection of grid points will be divided by multiple grid points. When the graphics area at the grid junction is small, the contribution of the graphics at the grid junction to the process fluctuation of the grid point is negligible, but when the graphics are...

AI Technical Summary

Problems solved by technology

[0010] It can be seen from the comparison that the graphics at the intersection of the grid points weaken the geometric information extracted from the graphics due to the segmentation of the graphics. When the chemical mechanical polishing process simulation prediction is performed on the above-mentioned extracted geometric information, the influence of the graphics at the intersection of the grid points on the process fluctuation will not be correctly predicted, so in the process of hotspot detection, it is easy to miss the hotspot of the graph at the junction of the grid points

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