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An integrated structure of an optical chip and its manufacturing method

A technology of optical chips and manufacturing methods, applied in the field of optical sensors, can solve problems such as expensive and complex structures, and achieve the effects of improving flexibility, simplifying the process flow, and reducing costs

Active Publication Date: 2018-08-03
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, most of the current packaging forms of optical sensors have complex structures and are very expensive, which puts forward high requirements on the technical level of packaging machines and engineers, and virtually sets the threshold for the development of optical sensor products.

Method used

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  • An integrated structure of an optical chip and its manufacturing method
  • An integrated structure of an optical chip and its manufacturing method
  • An integrated structure of an optical chip and its manufacturing method

Examples

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Embodiment Construction

[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0033] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0034] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses an optical chip integration structure and a manufacture method therefor. A side wall part is provided with a first inlet opening and a first outlet opening that are communicated with a first inner cavity, wherein the first inlet opening, the first outlet opening and the first inner cavity form a first injection molding passageway; a first light transmitting injection molding body which covers an optical sensor chip is formed in the first inner cavity through the first injection molding passageway via injection molding operation, and the side wall part is provided with a second inlet opening and a second outlet opening that are communicated with a second inner cavity; the second inlet opening, the second outlet opening and the second inner cavity form a second injection molding passageway; a second light transmitting injection molding body which covers an LED chip is formed in the second inner cavity through the second injection molding passageway via injection molding operation. The integration structure disclosed in the invention does not require any complex mold and is simple in process flow.

Description

technical field [0001] The invention relates to the field of optical sensors, and more specifically, the invention relates to an integrated structure of an optical chip; the invention also relates to a manufacturing method of the integrated structure. Background technique [0002] Optical sensors are increasingly used in consumer electronics, such as mobile phones, smart watches, and smart bracelets. Using optical sensors, proximity light detection, ambient light detection, heart rate detection, blood oxygen detection, gesture recognition, etc. can be realized. Generally, an optical sensor chip and an LED chip are integrated in a single package. The basic principle is that the LED chip emits light of a specific wavelength. After the light reaches the object to be measured, it will return a beam of light related to the object to be measured. The light reaches the optical receiving area of ​​the optical sensor chip, so that the optical sensor chip makes a corresponding respon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/56H01L25/16H01L23/31
CPCH01L23/3121H01L25/167H01L33/52H01L33/56H01L2224/48091H01L2924/00014
Inventor 郑国光
Owner GOERTEK MICROELECTRONICS CO LTD