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A packaged chip processing device and method containing abnormal non-volatile memory

A non-volatile memory technology, applied in static memory, instruments, etc., can solve the problems of waste, non-volatile memory stacked chips cannot work normally, etc., and achieve the effect of improving utilization rate

Active Publication Date: 2019-06-28
GIGADEVICE SEMICON (BEIJING) INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If one or several non-volatile memories in the packaged non-volatile memory stack chip are abnormal or invalid, it will cause the non-volatile memory stack chip to fail to work normally. The non-volatile memory stack chip is usually only Can be scrapped, resulting in great waste

Method used

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  • A packaged chip processing device and method containing abnormal non-volatile memory
  • A packaged chip processing device and method containing abnormal non-volatile memory
  • A packaged chip processing device and method containing abnormal non-volatile memory

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Embodiment Construction

[0030] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0031] One of the core concepts of the embodiments of the present invention is to process and utilize one or several non-volatile memory stacked chips with abnormal or invalid non-volatile memory; The modified address mapping module, the modified address mapped non-volatile signal writing module including the modified address mapped non-volatile signal, and the modified address mapped non-volatile signal enabling module are provided for each individual chip containing an abnormal non-volatile memory overlay Non-volatile memory modifies the address map so that it can continue to be used.

[0032] refer to figure 1 , which shows the structural diagram of Embodiment 1 of a chip-on-chip processing device containing abnormal non-volat...

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Abstract

The invention provides a folded-sealed chip processing device and method adopting abnormal non-volatile memorizers. The processing device comprises a PAD value defined non-volatile memorizer address mapping module for PAD value defined non-volatile memorizer address mapping and further comprises a modification address mapping module for modifying address mapping of each single abnormal non-volatile memorizer when it is determined that the abnormal non-volatile memorizers are contained in a tested abnormal non-volatile memorizer folded-sealed chip. The address of each single abnormal non-volatile memorizer is re-mapped by modifying the address mapping of the abnormal non-volatile memorizer folded-sealed chip, so that the volume of the folded-sealed chip is changed from big to small and can be continuously used, and the chip utilization rate is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor chips, in particular to a processing device and method for packaged chips containing abnormal non-volatile memories. Background technique [0002] With the rapid development of microelectronics technology, in order to meet the diverse needs of users for non-volatile memory capacity, a large-capacity non-volatile memory stacked chip is generated by stacking multiple small-capacity non-volatile memories together, so Design can also greatly reduce design costs. If one or several non-volatile memories in the packaged non-volatile memory stack chip are abnormal or invalid, it will cause the non-volatile memory stack chip to fail to work normally. The non-volatile memory stack chip is usually only Can be scrapped, causing great waste. [0003] Therefore, a technical problem that needs to be solved urgently by those skilled in the art is: how to process and utilize non-volatile memory-on-package ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C29/00
CPCG11C29/88
Inventor 马英潘荣华
Owner GIGADEVICE SEMICON (BEIJING) INC