Novel bus-bar duct socket device

Abstract

The invention discloses a novel bus-bar duct socket device and belongs to the low voltage power transmission and distribution technical field. The novel bus-bar duct socket device comprises a groove body, an insulation support arranged in the groove body and a plugging box mounted above the groove body; a plurality of busbar mounting ducts are evenly formed in the insulation support; a busbar is mounted in each busbar mounting duct; a mounting plate is arranged in the plugging box; and corresponding through holes are correspondingly formed in the mounting plate and the bottom surface of the plugging box; pin plugging devices are installed on the mounting plate; each pin plugging device includes a T-shaped pin plugging block and elastic plugging pins which are mounted on the pin plugging block, wherein each elastic plugging pin comprises a bent portion which is bent upwards toward the inner side of the tail end of the elastic plugging pin, wherein the bent portion protrudes inwards; each pin plugging device is provided with two elastic plugging pins; the two elastic plugging pins are symmetrically arranged on the pin plugging block of the corresponding pin plugging device, wherein the elastic plugging pins are riveted onto the pin plugging block; and a clamping groove which is matched with a busbar is formed in each pin plugging block. The novel bus-bar duct socket device of the invention is stable and reliable, and is free of conditions such as poor contact.

Description

technical field [0001] The invention relates to the technical field of low-voltage power transmission and distribution, in particular to a novel busway socket device. Background technique [0002] Due to the structure of the existing bus duct socket, the copper pins are not directly inserted outside the copper pins corresponding to the phase sequence during the plugging process of the bus main line current and the plug box, so the contact resistance is large and the overload capacity is low. Copper and aluminum materials are directly over-plated, which increases the temperature rise. Due to the different hardness of copper and aluminum materials, the number of times of plugging and unplugging between the two cannot meet the standards and usage requirements. Because the temperature rise of the pins exceeds the standard, it will cause a short circuit, and in severe cases, it will even cause a failure to burn the device. Therefore, need a kind of good stability, safe and reli...

AI Technical Summary

Problems solved by technology

[0002] Due to the structure of the existing bus duct socket, the copper pins are not directly inserted outside the copper pins corresponding to the phase sequence during the plugging process of the bus main line current and the plug box, so the contact resistance is large and the overload capacity is low. Copper and aluminum materials are directly over-plated, which increases the temperature rise

Due to the different hardness of copper and aluminum materials, the number of times of plugging and unplugging between the two cannot meet the standards and usage requirements. Because the temperature rise of the pins exceeds the standard, it will cause a short circuit, and in severe cases, it will even cause a failure to burn the device

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