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A kind of preparation method of film-coated ceramic substrate for PCB drilling

A technology of ceramic substrate and coating film is applied in the field of preparation of coated ceramic substrate for PCB drilling, which can solve the problems of unsustainable coating performance and low processing precision of aluminum substrate coating, and achieve the effect of prolonging the service life.

Active Publication Date: 2019-07-19
南通江涌投资开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: the processing accuracy of the existing aluminum substrate is not high, and the coating performance is not durable. In order to improve this defect and overcome its shortcomings, the present invention provides a coated aluminum substrate for PCB drilling preparation method

Method used

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  • A kind of preparation method of film-coated ceramic substrate for PCB drilling

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Effect test

Embodiment 1

[0021] A preparation method of a film-coated ceramic substrate for PCB drilling, comprising the steps of:

[0022] Step 1. Preparation of ceramic substrate: Take 60Kg of nano-alumina, 10Kg of zirconia, 2 Kg of titanium oxide, 5 Kg of white carbon black and 3 Kg of calcium oxide, put them into a grinder to grind and disperse evenly, put them into a mold, and cold press Forming, and then high-temperature calcination, the calcination temperature is 1250°C, the calcination pressure is 650MPa, the calcination time is 5h, and the ceramic substrate is prepared after cooling;

[0023] Step 2, prepare modified silicone resin: take polyethylene terephthalate 0.8 Kg, polyisocyanate 0.6Kg, terephthalic acid 0.15 Kg, dioctyl phthalate 0.12 Kg, methyl phenyl Dimethoxysilane 0.34 Kg, polyphenylsiloxane 0.41Kg and alkyl polydimethylsiloxane 0.58Kg are put into the reactor, add deionized water 0.8 Kg, stir evenly, add cumene over Hydrogen oxide 0.18 Kg, heated for reaction, polymerization rea...

Embodiment 2

[0026] A preparation method of a film-coated ceramic substrate for PCB drilling, comprising the steps of:

[0027] Step 1. Preparation of ceramic substrate: Take 80Kg of nano-alumina, 20 Kg of zirconia, 6 Kg of titanium oxide, 10Kg of white carbon black and 8 Kg of calcium oxide, put them into a grinder, grind and disperse evenly, put them into a mold, and cold press Forming, and then high-temperature calcination, the calcination temperature is 1300°C, the calcination pressure is 700MPa, the calcination time is 7h, and the ceramic substrate is prepared after cooling;

[0028] Step 2, prepare modified silicone resin: take polyethylene terephthalate 0.8 Kg, polyisocyanate 0.6Kg, terephthalic acid 0.15 Kg, dioctyl phthalate 0.12 Kg, methyl phenyl Dimethoxysilane 0.34 Kg, polyphenylsiloxane 0.41Kg and alkyl polydimethylsiloxane 0.58Kg are put into the reactor, add deionized water 0.8 Kg, stir evenly, add cumene over Hydrogen oxide 0.18 Kg, heated for reaction, polymerization reac...

Embodiment 3

[0031] A preparation method of a film-coated ceramic substrate for PCB drilling, comprising the steps of:

[0032] Step 1. Preparation of ceramic substrate: Take 72Kg of nano-alumina, 15 Kg of zirconia, 5 Kg of titanium oxide, 710Kg of white carbon black and 6 Kg of calcium oxide, put them into a grinder, grind and disperse evenly, put them into a mold, and cold press Forming, and then high-temperature calcination, the calcination temperature is 1280°C, the calcination pressure is 670MPa, the calcination time is 6h, and the ceramic substrate is prepared after cooling;

[0033] Step 2, preparation of modified silicone resin: take polyethylene terephthalate 0.5Kg, polyisocyanate 0.3Kg, terephthalic acid 0.1Kg, dioctyl phthalate 0.1Kg, methyl phenyl Dimethoxysilane 0.2 Kg, polyphenylsiloxane 0.2 Kg and alkyl polydimethylsiloxane 0.2Kg are put into the reactor, add deionized water 0.6Kg, stir well, add cumene over Hydrogen oxide 0.15 Kg, heated for reaction, polymerization reacti...

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Abstract

Belonging to the technical field of PCB, the invention relates to a preparation method of a coated ceramic substrate for PCB drilling. The method includes the steps of: 1. preparing a ceramic substrate; 2. preparing modified organic silicon resin; and 3. by weight part, taking the modified organic silicon resin, an acrylic resin emulsion, methylsilicone oil, a coupling agent, a film-forming assistant and deionized water, mixing the substances evenly, then coating the ceramic substrate with the mixture, and performing curing. The preparation method of the coated ceramic substrate for PCB drilling adopts ceramic material as the substrate, and coats the ceramic substrate with a layer of modified organic silicon resin film, not only can guarantee ideal drilling precision and drilling quality, but also effectively prolongs the service life of the substratet the same time.

Description

technical field [0001] The invention relates to a method for preparing a film-coated ceramic substrate for PCB drilling, and belongs to the technical field of substrate materials for PCB drilling. Background technique [0002] With the continuous development of electronic technology and the continuous improvement of PCB drilling technology, the requirements for substrates are also getting higher and higher. Existing substrates for PCB drilling use a variety of materials, among which aluminum foil is mostly used. Aluminum foil has good processing performance and low cost, so it is widely used. However, the current drilling processing technology is becoming more and more precise, and a single aluminum foil can no longer adapt to this refined processing mode. On the one hand, the problems of surface warping of aluminum foil and drilling offset problems lead to a decrease in drilling accuracy; On the one hand, the weather resistance of aluminum foil is short, which is not condu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/10C04B35/622C04B41/84
CPCC04B35/10C04B35/622C04B41/4905C04B41/84C04B2235/3208C04B2235/3217C04B2235/3232C04B2235/3244C04B2235/424C04B41/4857C04B41/46
Inventor 薛常刚
Owner 南通江涌投资开发有限公司