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Image sensor chip packaging structure and packaging method

An image sensor chip, packaging method technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., to achieve the effect of eliminating poor imaging and ghosting, and improving imaging quality

Active Publication Date: 2019-12-20
CHINA WAFER LEVEL CSP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The problem solved by the present invention is to improve the imaging quality of the image sensor chip by providing a novel image sensor chip packaging structure and its packaging method to eliminate defects such as poor imaging of the image sensor chip and ghost images.

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  • Image sensor chip packaging structure and packaging method
  • Image sensor chip packaging structure and packaging method
  • Image sensor chip packaging structure and packaging method

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Embodiment Construction

[0023] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0024] It should be noted that the purpose of providing these drawings is to facilitate the understanding of the embodiments of the present invention, and should not be interpreted as undue limitations on the present invention. For clarity, the dimensions shown in the figures are not drawn to scale and may be enlarged, reduced or otherwise changed. In addition, the three-dimensional space dimensions of length, width and depth should be included in actual production. Additionally, configurations described below in which a first feature is "on" a second feature may include embodiments where the first and seco...

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Abstract

The invention provides an image sensor chip packaging structure and a packaging method thereof. The packaging structure comprises an image sensor chip and a transparent substrate. The image sensor chip has a first side and a second side which face each other, and the first side has a photosensitive area. The transparent substrate has a first surface and a second surface which face each other, and the first surface covers the first side of the image sensor chip. The image sensor chip packaging structure further comprises a light absorption layer which covers the sidewalls of the transparent substrate. By forming the light absorption layer at least on the sidewalls of the transparent substrate of the image sensor chip packaging structure, the defects of the image sensor chip, such as bad imaging and ghost, are eliminated, and the imaging quality of the image sensor chip is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to the packaging technology of image sensor chips. Background technique [0002] With the development of light and shadow technologies such as photography, image sensor chips, as functional chips that can convert received light signals into electrical signals, are often used in cameras of electronic products, and there is a huge market demand. [0003] At the same time, the packaging technology of image sensor chips has also made great progress. Today's mainstream image sensor chip packaging technology is Wafer Level Chip Size Packaging (WLCSP), which is the packaging technology for the entire wafer. The technology of packaging and testing and then cutting to obtain a single finished chip. The size of a single finished chip packaged by this packaging technology is almost the same as that of a single grain, which meets the market's increasingly light, small, short, thin and l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L21/56
CPCH01L21/56H01L23/3114H01L2224/11H01L2924/16235
Inventor 王之奇
Owner CHINA WAFER LEVEL CSP