Manufacturing method of flexible heat sink based on graphene large specific surface area

A technology with a large specific surface area and a manufacturing method, which is applied to semiconductor devices, electric solid-state devices, semiconductor/solid-state device components, etc., to achieve the effect of simple heat dissipation, efficient and reliable performance, and enhanced heat emission.

Active Publication Date: 2019-05-17
CHANGZHOU RUIFENGTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing graphene-based heat dissipation devices are static passive heat dissipation, and there is still a lot of room for improvement in their heat dissipation performance

Method used

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  • Manufacturing method of flexible heat sink based on graphene large specific surface area
  • Manufacturing method of flexible heat sink based on graphene large specific surface area
  • Manufacturing method of flexible heat sink based on graphene large specific surface area

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A kind of manufacturing method based on graphene large specific surface area flexible radiator, comprises the following steps:

[0034] 1) Reference figure 1 , to prepare a high aspect ratio micro-hole array mold: refer to figure 1 (a), first use surface plasma to carry out surface activation treatment to smooth copper base 1; figure 1 (b), then the copper substrate 1 surface deposition layer thickness is the silver conductive film 2 of 300nm; figure 1 (c), 1(d) and 1(e), select SU-8 negative photoresist, and obtain a photoresist coating with a thickness of 500 μm through multiple coatings, pre-baking, re-leveling, and pre-baking ; refer to figure 1 (f), by exposing for 50 seconds each time and exposing 10 times, the ultraviolet exposure reaches the exposure dose; the post-baking of the photoresist is completed by stepping the temperature at intervals of 5°C and cooling down; refer to figure 1 (g), then use the special developing solution 4 in the developing tank 16...

Embodiment 2

[0042] A kind of manufacturing method based on graphene large specific surface area flexible radiator, comprises the following steps:

[0043] 1) Reference figure 1 , to prepare a high aspect ratio micro-hole array mold: refer to figure 1 (a), first use the mixed solution of sulfuric acid and hydrogen peroxide to carry out surface activation treatment to smooth aluminum substrate 1, the volume ratio of sulfuric acid and hydrogen peroxide is 2:1; Refer to figure 1 (b), then aluminum substrate 1 surface deposition thickness is the platinum conductive film 2 of 1000nm; figure 1 (c), 1(d) and 1(e), select SU-8 negative photoresist, and obtain a photoresist coating with a thickness of 50000 μm through multiple coatings, pre-baking, re-leveling, and pre-baking ; refer to figure 1 (f), by exposing for 1000 seconds each time, 10 times of sub-exposure, UV exposure reaches the exposure dose; adopt stepwise heating and cooling at intervals of 15°C to complete the post-baking of the ph...

Embodiment 3

[0051] A kind of manufacturing method based on graphene large specific surface area flexible radiator, comprises the following steps:

[0052] 1) Reference figure 1 , to prepare a high aspect ratio micro-hole array mold: refer to figure 1 (a), first use surface plasma to carry out surface activation treatment to smooth graphite plate substrate 1; figure 1 (b), then the graphite plate substrate 1 surface deposition layer thickness is the conductive film 2 of 700nm, and the conductive film 2 is an ITO film; figure 1 (c), 1(d) and 1(e), select SU-8 negative photoresist, and obtain a photoresist coating with a thickness of 25000 μm through multiple coatings, pre-baking, re-leveling, and pre-baking ; refer to figure 1 (f), by exposing for 1500 seconds each time and exposing 10 times, the ultraviolet exposure reaches the exposure dose; the post-baking of the photoresist is completed by stepping the temperature at intervals of 10°C and cooling down; refer to figure 1 (g), then us...

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Abstract

The invention discloses a production method of flexible radiator based on graphene high specific surface area. The production method comprises the steps of preparing a nanometer pore array model with high aspect ratio; preparing a flexible nanometer radiating column array with high aspect ratio; preparing a flexible nanometer radiating column array with a magnetic polymer micro magnetic head on the top; preparing a flexible nanometer radiating column array with a magnetic polymer micro magnetic head on the top and with a porous surface; preparing a graphene high specific surface area flexible radiating device; preparing a graphene high specific surface area flexible radiator. The graphene high specific surface area flexible radiator has the advantages of being simple and direct in radiating mode, efficient and reliable in performance. A periodic variable magnetic field is provided by rotation of magnetic vanes, the magnetic field drives a graphene porous flexible nanometer radiating column array to rotate so as to enhance discharge of heat; meanwhile, airflow can be generated in the rotating process of a magnetic vane fan, and the airflow can enhance the rotation of the graphene porous flexible radiator to further achieve the discharge of heat.

Description

technical field [0001] The invention relates to the fields of micro-nano manufacturing and semiconductor heat dissipation manufacturing, in particular to a method for manufacturing a flexible heat sink based on graphene with a large specific surface area. Background technique [0002] With the development of computer technology, the computing speed of the central processing unit and the chip is getting higher and higher, and its integration is getting higher and higher, the volume is getting smaller and smaller, and the heat generation is soaring. 55% of the failure of electronic equipment is caused by overheating. . Therefore, improving its heat dissipation performance has become one of the key issues that need to be solved urgently in the field of electronic manufacturing. [0003] The current mainstream heat dissipation methods include air cooling, water cooling, semiconductor and heat pipe cooling, etc. Among them, the air-cooled heat dissipation method uses a heat dis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373
Inventor 刘红忠雷彪尹磊史永胜陈邦道
Owner CHANGZHOU RUIFENGTE TECH CO LTD
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