A height-limited solder preform

A preformed solder sheet and solder sheet technology, which is applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problem of difficulty in controlling the thickness of the metal alloy layer with uniform size, poor uniformity of solder layer thickness, and different degrees of dissolution and other problems, to achieve the effect of simple and easy welding conditions, fast welding speed and less residue
CN106475702BActive Publication Date: 2020-12-15SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
7 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
Publication Date
2020-12-15

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
Patent Text Reader

Abstract

The invention relates to the technical field of soldering materials and particularly discloses a height-limited type solder preform. The height-limited type solder preform comprises a solder preform matrix and metal wires. The solder preform matrix is in a cuboid shape. One length*width surface of the solder preform matrix is provided with at least two grooves parallel to the width edge of the surface. The length of each groove is equal to that of the width edge of the surface. The depth of each groove is smaller than that of the solder preform. The dimensions of each metal wire are equal to that of each groove, and each metal wire can be just embedded into the corresponding groove to be fixed. The melting point of each metal wire is 300 DEG C or above higher than that of the solder preform matrix. The preparation process of the height-limited type solder preform is simple and easy to operate. The height-limited type solder preform is low in cost, stable in soldering thickness, high in uniformity, low in voidage, and particularly suitable for high-reliability soldering having a certain requirement for the height of a solder layer in the process of electronic packaging.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of soldering materials, in particular to a height-limited solder preform, especially suitable for high-reliability soldering with certain requirements on the height of the solder layer in electronic packaging. Background technique

[0002] Solder preform is a kind of precision-shaped solder that can be made into different shapes, sizes and surface shapes according to requirements. It is suitable for various product manufacturing processes with small tolerances. It is widely used in printed circuit board (PCB) assembly, connectors And terminal equipment, chip connection, power module substrate attachment, filter connector and electronic component assembly and other fields. Solder preforms are usually used in occasions that have special requirements on the shape and quality of the solder, and can be made into any size and shape to meet customer needs. Solder preforms have the advantages of diverse shapes, goo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More