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Self-adaptive adjustment method for suction nozzle of chip mounter

A technology of self-adaptive adjustment and placement machine, which is applied to electrical components, electrical components, etc., can solve the problems of poor suction of nozzle components and unstable working conditions, and achieve the effect of saving labor monitoring costs and improving production efficiency.

Active Publication Date: 2017-03-08
SHENZHEN FAROAD INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a self-adaptive adjustment method for the suction nozzle of the placement machine, which can solve the problems such as poor suction of the suction nozzle components of the placement machine, unstable working state, etc.

Method used

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  • Self-adaptive adjustment method for suction nozzle of chip mounter
  • Self-adaptive adjustment method for suction nozzle of chip mounter
  • Self-adaptive adjustment method for suction nozzle of chip mounter

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Embodiment Construction

[0021] The principles and features of the present invention will be described below with reference to the accompanying drawings. The examples are only used to explain the present invention, but not to limit the scope of the present invention.

[0022] figure 1 It is a schematic structural diagram of a nozzle self-adaptive adjustment method of a placement machine of the present invention, such as figure 1 As shown in the figure, the present invention is an adaptive adjustment method for the suction nozzle of the placement machine. The vacuum air path of the placement machine is opened, and the suction nozzle rod is lowered to the designated position; the head control board continuously monitors the vacuum value in the suction nozzle, and according to the The monitored vacuum value controls the first operating state of the nozzle rod.

[0023] The nozzle rod is lowered to the specified position, which can be obtained according to the experience value. Under the normal condition...

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Abstract

The invention relates to a self-adaptive adjustment method for a suction nozzle of a chip mounter. The self-adpative adjustment method comprises the steps of opening a vacuum air path of the chip mounter, descending a suction nozzle rod to a designated position, continuously monitoring a vacuum value in the suction nozzle by a head control plate, and controlling a first running state of the suction nozzle rod according to the monitored vacuum value. By means of the characteristic that the vacuum value of the suction nozzle is in close relevant to the suction material condition of the suction nozzle, the self-adaptive adjustment is performed on the suction nozzle by monitoring the vacuum value in the suction nozzle and according to the vacuum value, the reject ratio of the suction material of the suction nozzle is reduced, the waste of components is reduced, and the suction success rate and stability of the suction nozzle are improved.

Description

technical field [0001] The invention relates to a suction nozzle of a placement machine, in particular to a self-adaptive adjustment method of a suction nozzle of a placement machine. Background technique [0002] In the prior art, after a period of use, the suction nozzles of the placement machine often suffer from poor component absorption and unstable working conditions due to aging and other conditions. The poor component suction is mainly due to insufficient air pressure in the suction nozzle. Pick up components. The problem of poor component absorption will cause a lot of waste of components and low patch efficiency. Reducing the defective rate of component pickup is an urgent problem to be solved in this field. SUMMARY OF THE INVENTION [0003] The technical problem to be solved by the present invention is to provide a self-adaptive adjustment method for the suction nozzle of the chip mounter, so as to solve the problems of poor suction of the suction nozzle compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
CPCH05K13/0408
Inventor 贾孝荣卜发军谢锐涛邓泽峰杨邦红
Owner SHENZHEN FAROAD INTELLIGENT EQUIP CO LTD
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