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A kind of encapsulation process of LED display module

A technology of LED display and packaging technology, which is applied in the direction of identification devices, instruments, semiconductor devices, etc., can solve the problems of insufficient display effect and low resolution, and achieve better and more delicate display effect, improved resolution, and improved reliability. Effect

Active Publication Date: 2019-03-05
SHENZHEN JIEJIANDA INNOVATION TECH CO LTD
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  • Abstract
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Problems solved by technology

[0002] At present, the LED display screens on the market generally adopt the in-line packaging process or the patch packaging process. Due to the limitation of the packaging form of these two packaging processes, in the prior art, because the display screen must use a bracket, only one red and green can be used. The combination of blue is used as a pixel, and the structure of the bracket will cause the distance between each pixel to be greater than 2Mm, so the resolution will be relatively low, and the display effect will not be delicate enough

Method used

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  • A kind of encapsulation process of LED display module

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Embodiment Construction

[0019] In conjunction with the accompanying drawings, the specific implementation manners of the present invention will be further described in detail, so as to make the technical solution of the present invention easier to understand and grasp.

[0020] A packaging process for an LED display module, comprising the following steps:

[0021] 1) The red, blue and green display chips are sealed on the surface of the colloid according to the law;

[0022] 2) Plating the first layer of conductive film on the back of the red, blue and green display chips, and carving off the excess film to form the required conductive lines, so that the chips are connected in series;

[0023] 3) Cover a layer of protective layer on the first layer of conductive film, and carve off the protective layer of each chip pad (BOND PAD) to expose the pad;

[0024] 4) Plating a second layer of conductive film on the protective layer, and carving off the excess film to form the required conductive line, and ...

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Abstract

The invention discloses a packaging technique of an LED display screen module. The packaging technique includes the following steps: packaging red, blue and green display chips on the surface of an adhesive in order; coating the back sides of the red, blue and green display chips with first conductive membranes, and removing the superfluous membranes through engraving to form needed conductive lines so that the chips are in series connection; covering the first conductive membranes with protective layers, and removing bond pad protective layers of all the chips through engraving to make bond pads exposed; coating the protective layers with second conductive membranes, removing the superfluous membranes through engraving to form needed conductive lines, and enabling conduction between the chips and a controller; and covering the second conductive membranes with adhesives to finally finish packaging of an LED display screen module. The packaging technique of the LED display screen module helps to increase pixels per unit area, improve display effects and save the cost.

Description

technical field [0001] The invention relates to the packaging of LED display screens, in particular to a packaging process for LED display screen modules. Background technique [0002] At present, the LED display screens on the market generally adopt the in-line packaging process or the patch packaging process. Due to the limitation of the packaging form of these two packaging processes, in the prior art, because the display screen must use a bracket, only one red and green can be used. The combination of blue is used as a pixel, and the structure of the bracket will cause the distance between each pixel to be greater than 2Mm, so the resolution will be relatively low, and the display effect will not be delicate enough. Contents of the invention [0003] In view of this, the purpose of the present invention is to provide a packaging process for LED display modules without substrate packaging, higher splicing efficiency and more delicate display effect. [0004] In order t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/48H01L33/52H01L25/075G09F9/33
CPCG09F9/33H01L25/0753H01L33/483H01L33/52H01L33/62H01L2933/005H01L2933/0066
Inventor 涂波
Owner SHENZHEN JIEJIANDA INNOVATION TECH CO LTD
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