Semiconductor processing equipment
A processing device and semiconductor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of difficulty in picking up multiple chips by the coring device, and achieve the effect of overcoming the chip arrangement that does not meet the requirements
Active Publication Date: 2019-06-07
MICROFOCUS TECH
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Problems solved by technology
[0004] In addition, there are similar problems in the installation of other types of chips. When the coring device picks up the chips, it is difficult for the coring device to pick up multiple chips at the same time because there may be a certain deviation in the relative position of each chip.
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[0033] The detailed description of the present invention directly or indirectly simulates the operation of the technical solution of the present invention mainly through programs, steps, logic blocks, processes or other symbolic descriptions. In the ensuing description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. Rather, the invention may be practiced without these specific details. These descriptions and representations herein are used by those skilled in the art to effectively convey the substance of their work to others skilled in the art. In other words, for the purpose of avoiding obscuring the present invention, well-known methods and procedures have not been described in detail since they have been readily understood.
[0034] Reference herein to "one embodiment" or "an embodiment" refers to a particular feature, structure or characteristic that can be included in at least one implementation of the pres...
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The invention discloses a semiconductor processing device used for processing a wafer attached to the first surface of an expansion film; the wafer is scribed so as to form a plurality of chips; the expansion film expands so as to allow the chips to mutually separate from each other, and the chip arrangement is controlled; the semiconductor processing device comprises an adjustable light source and a control unit; the adjustable light source comprises a lighting array and an optical path guiding part; the lighting array comprises a plurality of lighting units with adjustable power; the lights emitted by each lighting unit are transferred by the optical path guiding part and projected to the expansion film; the control unit forms light source control parameters, and sends the light source control parameters to the light source; the light source controls the power of each lighting unit of the light source according to the light source control parameters, thus controlling the expansion film to expand, and further controlling the chip arrangement. The semiconductor processing device uses the adjustable light source to control the expansion of the expansion film, thus further controlling the chip arrangement, and solving the problems in the prior art that the chip arrangement cannot satisfy requirements.
Description
【Technical field】 [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor processing device. 【Background technique】 [0002] The LED (light-emitting diode) display is composed of thousands or even tens of thousands of LED chips arranged in an array. The manufacture of traditional LED display screens includes the following processes: 1. Attach the grown LED wafer to the blue film, and use a dicing machine to slice the LED wafer, so that the LED wafer is cut into several LED chips ;2. Heat or mechanically stretch the blue film to make the blue film expand, so that each LED chip is separated from each other; 3. Use the coring device to pick up the LED chips one by one, and install the LED chips one by one to the corresponding installation of the LED display mounting seat On the point, an LED chip display array is formed. [0003] It takes a lot of man-hours to pick up and install the LED chips one by one, which increases the ...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67253
Inventor 何继中
Owner MICROFOCUS TECH