Dispensing mechanism with adjustable dispensing angle

A dispensing mechanism and point adjustment technology, which is applied to the device and coating of the surface coating liquid, can solve the problems of damaging the chip assembly, falling on the chip, affecting the quality of dispensing, etc.

Active Publication Date: 2018-11-02
D TEK TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditionally, it is inconvenient to adjust the dispensing position from the vertical direction. It is suitable for the needs of three-dimensional integrated circuits.
If the glue drop is sprayed on the wafer assembly in a non-vertical manner, the path of the glue drop will be parabolic due to gravity, and a slight deviation may cause the glue to fall on the wafer, which will affect the dispensing quality and even damage the wafer. assembly

Method used

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  • Dispensing mechanism with adjustable dispensing angle
  • Dispensing mechanism with adjustable dispensing angle
  • Dispensing mechanism with adjustable dispensing angle

Examples

Experimental program
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Effect test

Embodiment Construction

[0057] see figure 1 and figure 2 , the wafer assembly 9 is placed in a horizontal state and rotated, and the jetting head 20 injects glue droplets in the horizontal direction, and the to-be-glued part of the wafer assembly 9 includes a circumferential area 91 (including positions such as P1 and P5) and identification gaps Region 92 (contains P2, P3, P4, etc. positions). Here, the fan-shaped identifying notch area 92 is taken as an example, but the present invention is not limited thereto, for example, it can also be applied to identifying notch areas with other shapes. The glue droplet G ejected horizontally is originally accurately sprayed on the position P1 of the circumferential area 91. However, when the recognition notch area 92 of the wafer assembly 9 is rotated towards the jetting glue head 20, the path of the glue droplet G becomes a parabola due to gravity. The line may deviate from the position to be glued (such as the position of P2, P3, P4) in the identification...

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PUM

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Abstract

The invention discloses an adhesive dispensing mechanism with an adjustable adhesive dispensing angle. The adhesive dispensing mechanism is used for dispensing adhesives towards a wafer assembly. A recognition notch area and a circumference area are arranged in the to-be-glued positions of the wafer assembly. The adhesive dispensing mechanism comprises a fixedly holding and rotating device, a spraying adhesive dispensing head and an adhesive dispensing head bearing platform. The fixedly holding and rotating device comprises a fixedly holding unit used for fixedly holding the wafer assembly, an angle adjusting unit for adjusting the wafer assembly to incline by an angle, and a rotating unit for rotating the wafer assembly. The spraying adhesive dispensing head is used for spraying a plurality of adhesive drops towards the multiple to-be-glued positions of the wafer assembly. The adhesive dispensing head bearing platform is used for bearing the spraying adhesive dispensing head and controlling the initial jetting angle of the spraying adhesive dispensing head. The slope of the inclination angle of the wafer assembly is equal to the slope of the path of the multiple adhesive drops within a preset interval, and the preset interval is the shortest distance from the circumference of the wafer assembly to the bottom of the recognition notch area in the diameter direction of the wafer assembly.

Description

technical field [0001] The invention relates to a dispensing mechanism capable of adjusting the dispensing angle, which glues glue to a workpiece with a place to be glued by spraying, and particularly relates to a dispensing mechanism which can be applied to wafer assemblies. Background technique [0002] In order to reduce package size and improve electrical performance, semiconductor manufacturing has developed a three-dimensional stacking technology to manufacture three-dimensional integrated circuits (3D ICs). The volume of electronic products can be reduced by the manufacturing process of three-dimensional integrated circuits. In the assembly technology of three-dimensional integrated circuits, the stacking technology between chips is an important key. [0003] In the assembly technology of three-dimensional integrated circuits, through specific connection methods and chip thinning technology, the space and density can be effectively increased, the transmission distanc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C13/02
CPCB05C5/0212B05C13/00
Inventor 沈基盟陈毅均许庆丰
Owner D TEK TECHNOLOGY CO LTD
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