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A binder and high-temperature-resistant technology, applied in the direction of adhesives, non-polymer adhesive additives, inorganic adhesives, etc., can solve problems such as low construction efficiency, shortened service life of furnaces, and lack of strength, so as to improve construction Efficiency, high refractory temperature, good bonding effect
Active Publication Date: 2017-06-20
洛阳欧斯特节能科技有限公司
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Problems solved by technology
The bonding strength of ordinary adhesives comes from the soft clay in the ingredients, and the soft clay has no strength at all in the middle temperature range of 650-1000 °C because the crystal water has disappeared but has not yet reached the sintered state. Therefore, it cannot meet the use requirements of medium temperature kiln or high temperature kiln.
In the case of relatively large positive pressure in the kiln, because the adhesive has no bonding strength, the adhesive in the joint will soon be hollowed out, and the bonding failure will cause fire leakage inside the kiln, resulting in increased energy consumption. shortened service life
Moreover, the existing ordinary adhesives cannot realize the bonding between different materials in the kiln, and need to be used after mixing at the construction site, which brings inconvenience to the construction
[0003] In view of the defects of the above-mentioned prior art, the inventor actively researches and innovates on the basis of years of rich practical experience and professional knowledge in the manufacture of such products, in order to create a new type of inorganic composite high-temperature-resistant adhesive, which can improve the general existing The adhesive has no bonding strength in the medium temperature range, has a short service life, has a single function, cannot realize the bonding between different materials at the same time, and has the defects of low construction efficiency, which makes it more practical
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Embodiment 1
[0042] Raw material composition:
[0043] Percentage by weight: 36% of sodium silicate, 55% of kaolin, 9% of kyanite powder, and the modulus of sodium silicate is 3.55.
[0044] Put sodium silicate and water into a high-speed disperser at a weight ratio of 1:1.3 to disperse for 5 minutes, disperse fully, and become liquid; then add kaolin, disperse at high speed for 10 minutes; finally add kyanite powder, slowly Stir for 1 minute, discharge the ingredients, and seal the package.
Embodiment 2
[0046] Raw material composition:
[0047] Percentage by weight: 40% sodium silicate, 51% kaolin, 9% kyanite powder, and the modulus of sodium silicate is 3.45.
[0048] Put sodium silicate and water into a high-speed disperser at a weight ratio of 1:1.4 to disperse for 5 minutes, disperse fully, and become liquid; then add kaolin, disperse at high speed for 10 minutes; finally add kyanite powder, slowly Stir for 1 minute, discharge the ingredients, and seal the package.
Embodiment 3
[0050] Raw material composition:
[0051] Percentage by weight: 35% of sodium silicate, 57% of kaolin, 8% of kyanite powder, and the modulus of sodium silicate is 3.45.
[0052] Put sodium silicate and water into a high-speed disperser at a weight ratio of 1:1.5 to disperse for 5 minutes, disperse fully, and become liquid; then add kaolin, disperse at high speed for 10 minutes; finally add kyanite powder, slowly Stir for 1 minute, discharge the ingredients, and seal the package.
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Abstract
The invention relates to a high-temperature-resistant binder. The high-temperature-resistant binder comprises the following components in percentage by weight: 35-40% of a sodium silicate water solution, 50-57% of kaolin with ultralow alkali metal content and 8-10% of kyanite powder. The preparation method comprises the following steps: adding the high-modulus sodium silicate and water into a high-speed dispersing machine according to a ratio, and fully dispersing; then adding kaolin with ultralow alkali metal content, and dispersing for 10 minutes at a high speed; finally adding the kyanite powder, slowly stirring for 1 minute, discharging, and finally sealing and packaging. The high-temperature-resistant binder disclosed by the invention is non-toxic and harmless, is friendly to a human body and environment, and is high in fire resistance and high in bonding strength, the bonding strength in any one temperature interval between the normal temperature and the highest use temperature is more than 2 MPa, the defect that most binders have no bonding strength at the temperature between 650 DEG C and 1000 DEG C is overcome, bonding between different materials can be realized; compared with an existing binder, the binder is more convenient to use, and the construction efficiency is improved.
Description
technical field [0001] The invention belongs to the technical field of binder materials, and in particular relates to an inorganic composite binder for high temperature resistant materials. Background technique [0002] Adhesives are used in the bonding and masonry of refractory materials in various high-temperature kiln masonry. The high temperature resistance of the adhesive is one of the important factors affecting the strength of refractory materials. The bond strength of the adhesive is one of the main factors affecting the structural integrity and tightness of the kiln. The bonding strength of ordinary adhesives comes from the soft clay in the ingredients, and the soft clay has no strength at all in the middle temperature range of 650-1000 °C because the crystal water has disappeared but has not yet reached the sintered state. Therefore, it cannot meet the requirements for use in the middle temperature section of a medium temperature kiln or a high temperature kiln. ...
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the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information
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