Automatic silicon wafer inserting device capable of adapting to different sizes of baskets

Abstract

The invention discloses an automatic silicon wafer inserting device capable of adapting to different sizes of baskets, which comprises a rack, a first lifting device, a distributing device, a silicon wafer sucking device, a silicon wafer transmission device and a second lifting device, and is characterized in that the first lifting device, the distributing device, the silicon wafer sucking device, the silicon wafer transmission device and the second lifting device are installed on the rack, the first lifting device and the second lifting device are respectively located at two ends of the silicon wafer transmission device in the transmission direction, two sides of the silicon wafer transmission device are respectively provided with a first protection rod and a second protection rod, and the distance between the first protection rod and the second protection rod can be adjusted. The automatic silicon wafer inserting device can adapt to transportation and insertion of different sizes of silicon wafers through the protection rods with the distance therebetween being adjustable.

Description

Technical field [0001] The application belongs to the field of semiconductor silicon wafer processing and solar cell silicon wafer processing, and in particular relates to an automatic chip inserting device adapted to flower baskets of different sizes. Background technique [0002] In the production process of solar cell silicon wafers, there is a process that requires people to insert the silicon wafers one by one into a special loading box. In the prior art, people usually use manual operations to complete the insertion operation. The labor intensity is high, the efficiency is low, and the silicon chip is easily damaged during the insertion process. [0003] Chinese patent CN203932088U discloses a fully automatic silicon wafer inserting machine, which includes a body. The body is provided with a silicon wafer output device, a silicon wafer transfer device and a wafer loading box. The silicon wafer output device is connected to the silicon wafer through a suction cup. The silicon...

AI Technical Summary

Problems solved by technology

[0004] 1. Unable to adapt to the insertion of silicon wafers of different sizes;

[0005] 2. The silicon wafer in the silicon wafer output device is prone to adhesion between the upper and lower sides;

[0006] 3. After the silicon wafers are loaded, manual handling is still required, and the degree of automation is still not high

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