Unlock instant, AI-driven research and patent intelligence for your innovation.

Finite element simulation analysis method for pseudo soldering detection

A simulation analysis and finite element technology, applied in design optimization/simulation, special data processing applications, instruments, etc., can solve problems such as complex influence laws, few studies, and insufficient depth

Active Publication Date: 2017-07-25
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, the research results on the detection and identification of solder joint defects have mostly focused on the regular-shaped solder balls in BGA packages, and the solder joints of devices with leads have irregular shapes, and the influence of defects is more complicated. The relevant research is not much and not deep enough.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Finite element simulation analysis method for pseudo soldering detection
  • Finite element simulation analysis method for pseudo soldering detection
  • Finite element simulation analysis method for pseudo soldering detection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0026] In order to better illustrate the technical content of the present invention, the theory applied in the present invention will be described first. The present invention is based on the eddy current pulse thermal imaging technology to conduct finite element analysis on the solder joint defect, wherein, the eddy current pulse thermal imaging detection technology uses a coil carrying high-frequency alternating current to approach the test piece, and according to the principle of electromagnetic induction, it will be on the test piece Eddy currents are generated by surface or internal induction. Due to the resistance of the conductor itself, according to Joule's law, part of the eddy current will be converted from electrical energy to heat energy inside the specimen, and the heat Q generated is

[0027]

[0028] where σ represents the electrical conductivity of the material, J S Indicates the induced eddy current density.

[0029] The generated heat Q is transferred be...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thermal resistanceaaaaaaaaaa
Thermal resistanceaaaaaaaaaa
Thermal resistanceaaaaaaaaaa
Login to View More

Abstract

The invention discloses a finite element simulation analysis method for pseudo soldering detection. On the basis of an eddy current pulse thermal imaging technology, a finite element model of a soldering point is established, pseudo soldering is imported to carry out simulation analysis, the surface temperature distribution situation of the corresponding pin position of the soldering point is extracted to distinguish normal soldering points and pseudo soldering points, a thermoelectricity analogy method is used for calculating the thermal resistance value of a soldering point area, different types of pseudo soldering are distinguished according to the difference of soldering point thermal resistance, an analysis method is provided for the non-destructive testing of the pseudo soldering. The method has the advantages of being high in detection speed and accurate in defect detection, and a theoretical basis and a prediction result are provided for the pseudo soldering detection in engineering.

Description

technical field [0001] The invention belongs to the technical field of solder joint quality detection, and more specifically relates to a finite element simulation analysis method for false solder detection. Background technique [0002] With the rapid development of the electronic manufacturing industry, surface mount devices are widely used in circuit systems. The size of components is getting smaller and smaller, and the mounting density is getting higher and higher. Overheating or excessive temperature gradients will cause circuit systems to fail. According to statistics, nearly half of the failures of electronic products are caused by poor welding. Board-level packaging solder joints provide the mechanical and electrical connection between the chip and the circuit board. The failure of a single solder joint may cause the failure of the entire circuit system. Therefore, the quality of solder joints is a key factor affecting the reliability of the circuit system. In rece...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/50
CPCG06F30/23
Inventor 周秀云薛云陈亚秋
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA