A Finite Element Simulation Analysis Method for False Weld Detection
A simulation analysis, finite element technology, applied in design optimization/simulation, special data processing applications, etc., can solve the problems of irregular shape of solder joints, complex influence rules, and insufficient depth of leaded devices
Active Publication Date: 2020-02-04
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology
In recent years, the research results on the detection and identification of solder joint defects have mostly focused on the regular-shaped solder balls in BGA packages, and the solder joints of devices with leads have irregular shapes, and the influence of defects is more complicated. The relevant research is not much and not deep enough.
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[0026] In order to better illustrate the technical content of the present invention, the theory applied in the present invention will be described first. The present invention is based on the eddy current pulse thermal imaging technology to conduct finite element analysis on the solder joint defect, wherein, the eddy current pulse thermal imaging detection technology uses a coil carrying high-frequency alternating current to approach the test piece, and according to the principle of electromagnetic induction, it will be on the test piece Eddy currents are generated by surface or internal induction. Due to the resistance of the conductor itself, according to Joule's law, part of the eddy current will be converted from electrical energy to heat energy inside the specimen, and the heat Q generated is
[0027]
[0028] where σ represents the electrical conductivity of the material, J S Indicates the induced eddy current density.
[0029] The generated heat Q is transferred be...
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The invention discloses a finite element simulation analysis method for virtual welding detection, which establishes a finite element model of solder joints based on eddy current pulse thermal imaging technology and introduces virtual welding for simulation analysis, and extracts the surface temperature distribution of corresponding pin positions of solder joints. Distinguish between normal solder joints and virtual solder joints, and then use the thermoelectric analogy method to calculate the thermal resistance value of the solder joint area, and distinguish different virtual solder joints according to the difference in solder joint thermal resistance, thus providing an analysis for the non-destructive testing of virtual solder joints method, and the detection speed is fast, the detection of defects is accurate, and it also provides a theoretical basis and prediction results for the virtual welding detection in engineering.
Description
technical field [0001] The invention belongs to the technical field of solder joint quality detection, and more specifically relates to a finite element simulation analysis method for false solder detection. Background technique [0002] With the rapid development of the electronic manufacturing industry, surface mount devices are widely used in circuit systems. The size of components is getting smaller and smaller, and the mounting density is getting higher and higher. Overheating or excessive temperature gradients will cause circuit systems to fail. According to statistics, nearly half of the failures of electronic products are caused by poor welding. Board-level packaging solder joints provide the mechanical and electrical connection between the chip and the circuit board. The failure of a single solder joint may cause the failure of the entire circuit system. Therefore, the quality of solder joints is a key factor affecting the reliability of the circuit system. In rece...
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IPC IPC(8): G06F30/23
CPCG06F30/23
Inventor 周秀云薛云陈亚秋
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA