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Efficient preparation method for light emitting module circuit board

A technology for light-emitting modules and circuit boards, which is applied in the manufacture of printed circuits, printed circuits, electrical components, etc., can solve the problems of wasted production costs and inability to punch out, and achieve the goal of reducing production cost waste, reducing waste, and improving production efficiency Effect

Inactive Publication Date: 2017-08-15
昆山圆裕电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Stamping is carried out according to the structure of the finished product. At the same time, because the wiring angle is 100° to 90°, it is impossible to punch out all the shapes through a pair of stamping dies, which wastes production costs;

Method used

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  • Efficient preparation method for light emitting module circuit board
  • Efficient preparation method for light emitting module circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] This example shows an efficient method for preparing a light-emitting module circuit board, including the following steps:

[0031] 1) Refer to figure 2 , perform linear typesetting in the stamping die;

[0032] 2) Stamping to obtain a straight line circuit board 1;

[0033] 3) On the straight line circuit board 1 , it is necessary to set the angled wiring at the place where the bending equipment is used to pressurize and fold back, and obtain the required light-emitting module circuit board.

[0034] In step 3), the bending is set as a bending machine.

[0035] Step 3) comprises the following steps:

[0036] 3a) Place the linear circuit board 1 on the dotting platform for dotting at the bend;

[0037] 3b) Place the dotted linear circuit board 1 in the bending cavity, and then use a bending machine to bend the dotted part.

[0038] Step 1) includes steps such as:

[0039] 1a) Convert the length of the circuit board of the light-emitting module, and set the stampi...

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Abstract

The invention discloses an efficient preparation method for a light emitting module circuit board. The efficient preparation method comprises the following steps of 1) performing linear composing in a stamping die; 20 obtaining a linear circuit board through stamping; and 3) performing pressurizing and bending in a position, where angle bending and routing are needed, by bending equipment on the linear circuit board, and obtaining the required light emitting module circuit board. By virtue of the efficient preparation method for the light emitting module circuit board, efficient preparation of the light emitting module circuit board can be realized without using multiple pairs of stamping dies, so that waste of production cost can be reduced while production efficiency can be improved.

Description

technical field [0001] The invention relates to the preparation technology of electronic equipment components, in particular to the technical field of circuit board preparation. Specifically, it shows an efficient preparation method of a light-emitting module circuit board. Background technique [0002] With the development of society, electronic products are developing in the direction of fashion, beauty and novelty, and the internal structure of corresponding electronic products is becoming more and more complex; [0003] In order to avoid other components inside the electronic product, the circuit board used will set its wiring position at a 90° right angle to avoid interference with other components inside the electronic product during assembly; [0004] Circuit board preparation at this stage, refer to figure 1 : [0005] Stamping is carried out according to the structure of the finished product. At the same time, because the wiring angle is 100° to 90°, it is impossi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0014
Inventor 徐鈴
Owner 昆山圆裕电子科技有限公司